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| 型号： | LM22673MRX-5.0/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 15/27页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 5V 3A 8PSOP |
| 产品培训模块： | SIMPLE SWITCHER® Regulators LM315x & LM2267x SIMPLE SWITCHER® and WEBENCH |
| 标准包装： | 2,500 |
| 系列： | SIMPLE SWITCHER® |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 4.5 V ~ 42 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 500kHz |
| 电流 - 输出： | 3A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-PSOP-EP |
| 配用： | 551600236-001-ND - WEBENCH BUILD IT LM2267X 8-PSOP LM22673EVAL/NOPB-ND - BOARD EVALUATION FOR LM22673 |
| 其它名称： | LM22673MRX-5.0 |
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SNVS586N – SEPTEMBER 2008 – REVISED APRIL 2013
Thermal Considerations
The components with the highest power dissipation are the power diode and the power MOSFET internal to the
LM22673 regulator. The easiest method to determine the power dissipation within the LM22673 is to measure
the total conversion losses then subtract the power losses in the diode and inductor. The total conversion loss is
the difference between the input power and the output power. An approximation for the power diode loss is:
(16)
Where V D is the diode voltage drop. An approximation for the inductor power is:
(17)
where R L is the DC resistance of the inductor and the 1.1 factor is an approximation for the AC losses.
The regulator has an exposed thermal pad to aid power dissipation. Adding multiple vias under the device to the
ground plane will greatly reduce the regulator junction temperature. Selecting a diode with an exposed pad will
also aid the power dissipation of the diode. The most significant variables that affect the power dissipation of the
regulator are output current, input voltage and operating frequency. The power dissipated while operating near
the maximum output current and maximum input voltage can be appreciable. The junction-to-ambient thermal
resistance of the LM22673 will vary with the application. The most significant variables are the area of copper in
the PC board, the number of vias under the IC exposed pad and the amount of forced air cooling provided. A
large continuos ground plane on the top or bottom PCB layer will provide the most effective heat dissipation. The
integrity of the solder connection from the IC exposed pad to the PC board is critical. Excessive voids will greatly
diminish the thermal dissipation capacity. The junction-to-ambient thermal resistance of the LM22673 SO
PowerPAD package, and the PFM package, are specified in the Electrical Characteristics table. See application
note AN-2020 ( SNVA419 ) for more information.
Copyright ? 2008–2013, Texas Instruments Incorporated
Product Folder Links: LM22673
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM22673MRX-ADJ | 制造商:Texas Instruments 功能描述:Conv DC-DC Single Inv/Step Down 4.5V to 42V 8-Pin PSOP EP T/R |
| LM22673MRX-ADJ/NOPB | 功能描述:直流/直流开关转换器 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| LM22673QMR-5.0/NOPB | 制造商:Texas Instruments 功能描述:IC REG BUCK 5V 3A 8SOPWRPAD 制造商:Texas Instruments 功能描述:42V, 3A SIMPLE SWITCHER Step-Down Volta |
| LM22673QMR-ADJ/NOPB | 制造商:Texas Instruments 功能描述:IC REG BUCK ADJ 3A 8SOPWRPAD |
| LM22673QMRE-5.0/NOPB | 制造商:Texas Instruments 功能描述:IC REG BUCK 5V 3A 8SOPWRPAD 制造商:Texas Instruments 功能描述:42V, 3A SIMPLE SWITCHER Step-Down Volta |
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