参数资料
型号: LM2594PADJG
厂商: ON Semiconductor
文件页数: 17/25页
文件大小: 0K
描述: IC REG BUCK ADJ 0.5A 8DIP
标准包装: 50
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1.23 V ~ 37 V
输入电压: 4.5 V ~ 40 V
PWM 型: 电压模式
频率 - 开关: 150kHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
包装: 管件
供应商设备封装: 8-PDIP
LM2594
d + on + O ,
V in
Since the current rating of the LM2594 is only 0.5 A, the
total package power dissipation for this switcher is quite
low, ranging from approximately 0.1 W up to 0.75 W under
varying conditions. In a carefully engineered printed circuit
board, the through ? hole DIP package can easily dissipate up
to 0.75 W, even at ambient temperatures of 60 ° C, and still
keep the maximum junction temperature below 125 ° C.
Thermal Analysis and Design
The following procedure must be performed to determine
the operating junction temperature. First determine:
1. P D(max) maximum regulator power dissipation in the
application.
2. T A(max ) maximum ambient temperature in the
application.
3. T J(max) maximum allowed junction temperature
(125 ° C for the LM2594). For a conservative
design, the maximum junction temperature
should not exceed 110 ° C to assure safe
operation. For every additional +10 ° C
temperature rise that the junction must
withstand, the estimated operating lifetime
of the component is halved.
4. R q JC package thermal resistance junction ? case.
5. R q JA package thermal resistance
junction ? ambient.
(Refer to Maximum Ratings on page 3 of this data sheet or
R q JC and R q JA values).
The following formula is to calculate the approximate
total power dissipated by the LM2594:
P D = (V in x I Q ) + d x I Load x V sat
where d is the duty cycle and for buck converter
t V
T
I Q (quiescent current) and V sat can be found in the
LM2594 data sheet,
V in is minimum input voltage applied,
V O is the regulator output voltage,
I Load is the load current.
The dynamic switching losses during turn ? on and
turn ? off can be neglected if proper type catch diode is used.
The junction temperature can be determined by the
following expression:
T J = (R q JA ) (P D ) + T A
where (R q JA )(P D ) represents the junction temperature rise
caused by the dissipated power and T A is the maximum
ambient temperature.
Some Aspects That can Influence Thermal Design
It should be noted that the package thermal resistance and
the junction temperature rise numbers are all approximate,
and there are many factors that will affect these numbers,
such as PC board size, shape, thickness, physical position,
location, board temperature, as well as whether the
surrounding air is moving or still.
Other factors are trace width, total printed circuit copper
area, copper thickness, single ? or double ? sided, multilayer
board, the amount of solder on the board or even color of the
traces.
The size, quantity and spacing of other components on the
board can also influence its effectiveness to dissipate the heat.
12 to 25 V
Feedback
R4
Unregulated
DC Input
+V in
LM2594
L1
100 m H
C in
100 m F/50 V
ON/OFF
GND
D1
1N5819
C out
220 m F
R3
C FF
? 12 V @ 0.7 A
Regulated
Output
Figure 23. Inverting Buck ? Boost Develops ? 12 V
ADDITIONAL APPLICATIONS
Inverting Regulator
An inverting buck ? boost regulator using the
LM2594 ? ADJ is shown in Figure 23. This circuit converts
a positive input voltage to a negative output voltage with a
common ground by bootstrapping the regulators ground to
the negative output voltage. By grounding the feedback pin,
the regulator senses the inverted output voltage and
regulates it.
In this example the LM2594 is used to generate a ? 12 V
output. The maximum input voltage in this case cannot
exceed +28 V because the maximum voltage appearing
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