参数资料
型号: LM2595ATPBCKGEVB
厂商: ON Semiconductor
文件页数: 17/25页
文件大小: 0K
描述: EVAL BOARD FOR LM2595ATPBCKG
设计资源: LM2595ATPBCKGEVB BOM
LM2595ATPBCKGEVB Gerber Files
LM2595ATPBCKGEVB Schematic
特色产品: Evaluation Boards & Kits
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 5V
电流 - 输出: 1A
输入电压: 4.5 ~ 40 V
稳压器拓扑结构: 降压
频率 - 开关: 150kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LM2595
其它名称: LM2595ATPBCKGEVBOS
LM2595
3. T J(max)
maximum allowed junction temperature
(125 ° C for the LM2595). For a conservative
design, the maximum junction temperature
should not exceed 110 ° C to assure safe
operation. For every additional +10 ° C
temperature rise that the junction must
Packages Not on a Heatsink (Free ? Standing)
For a free ? standing application when no heatsink is used,
the junction temperature can be determined by the following
expression:
T J = (R q JA ) (P D ) + T A
d + on + O ,
V in
withstand, the estimated operating lifetime
of the component is halved.
4. R q JC package thermal resistance junction ? case.
5. R q JA package thermal resistance junction ? ambient.
(Refer to Maximum Ratings on page 2 of this data sheet or
R q JC and R q JA values).
The following formula is to calculate the approximate
total power dissipated by the LM2595:
P D = (V in x I Q ) + d x I Load x V sat
where d is the duty cycle and for buck converter
t V
T
I Q (quiescent current) and V sat can be found in the
LM2595 data sheet,
V in is minimum input voltage applied,
V O is the regulator output voltage,
I Load is the load current.
The dynamic switching losses during turn ? on and
turn ? off can be neglected if proper type catch diode is used.
The junction temperature can be determined by the
following expression:
T J = (R q JA ) (P D ) + T A
where (R q JA )(P D ) represents the junction temperature rise
caused by the dissipated power and T A is the maximum
ambient temperature.
Where (R q JA ) (P D ) represents the junction temperature rise
caused by the dissipated power and T A is the maximum
ambient temperature.
Packages on a Heatsink
If the actual operating junction temperature is greater than
the selected safe operating junction temperature determined
in step 3, than a heatsink is required. The junction
temperature will be calculated as follows:
T J = P D (R q JA + R q CS + R q SA ) + T A
Where R q JC is the thermal resistance junction ? case,
R q CS is the thermal resistance case ? heatsink,
R q SA is the thermal resistance heatsink ? ambient.
If the actual operating temperature is greater than the
selected safe operating junction temperature, then a larger
heatsink is required.
Some Aspects That can Influence Thermal Design
It should be noted that the package thermal resistance and
the junction temperature rise numbers are all approximate,
and there are many factors that will affect these numbers,
such as PC board size, shape, thickness, physical position,
location, board temperature, as well as whether the
surrounding air is moving or still.
Other factors are trace width, total printed circuit copper
area, copper thickness, single ? or double ? sided, multilayer
board, the amount of solder on the board or even color of the
traces.
The size, quantity and spacing of other components on the
board can also influence its effectiveness to dissipate the
heat.
12 to 25 V
Feedback
R4
Unregulated
DC Input
+V in
LM2595
L1
100 m H
C in
100 m F/50 V
ON/OFF
GND
D1
1N5819
R3
C out
220 m F
C FF
? 12 V @ 0.7 A
Regulated
Output
Figure 23. Inverting Buck ? Boost Develops ? 12 V
http://onsemi.com
17
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