参数资料
型号: LM2735XMYEVAL
厂商: National Semiconductor
文件页数: 5/58页
文件大小: 0K
描述: BOARD DEMO EVAL LM2735 8-MSOP
标准包装: 1
主要目的: DC/DC,步升
输出及类型: 1,非隔离
输出电压: 12V
电流 - 输出: 500mA
输入电压: 3 ~ 5.5 V
稳压器拓扑结构: 升压
频率 - 开关: 1.6MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LM2735

SNVS485F – JUNE 2007 – REVISED APRIL 2013
Electrical Characteristics
Limits in standard type are for T J = 25°C only; limits in boldface type apply over the junction temperature range of (T J = -
40°C to 125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values
represent the most likely parametric norm at T J = 25°C, and are provided for reference purposes only. V IN = 5V unless
otherwise indicated under the Conditions column.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
? 40°C ≤ to T J ≤ +125°C (SOT-23)
0°C ≤ to T J ≤ +125°C (SOT-23)
? 40°C ≤ to T J ≤ +125°C (WSON)
1.230
1.236
1.225
1.255
1.255
1.255
1.280
1.274
1.285
V FB
Feedback Voltage
? 0°C ≤ to T J ≤ +125°C (WSON)
1.229
1.255
1.281
V
? 40°C ≤ to T J ≤ +125°C
1.220
1.255
1.290
(MSOP-PowerPAD)
0°C to T J +125°C (MSOP-PowerPAD)
1.230
1.255
1.280
Δ V FB /V IN
Feedback Voltage Line Regulation
V IN = 2.7V to 5.5V
0.06
%/V
I FB
Feedback Input Bias Current
0.1
1
μA
F SW
D MAX
D MIN
R DS(ON)
I CL
Switching Frequency
Maximum Duty Cycle
Minimum Duty Cycle
Switch On Resistance
Switch Current Limit
LM2735-X
LM2735-Y
LM2735-X
LM2735-Y
LM2735-X
LM2735-Y
SOT-23 and MSOP-PowerPAD
WSON
1200
360
88
91
2.1
1600
520
96
99
5
2
170
190
3
2000
680
330
350
kHz
%
%
m ?
A
SS
Soft Start
4
ms
I Q
Quiescent Current (switching)
Quiescent Current (shutdown)
LM2735-X
LM2735-Y
All Options V EN = 0V
7.0
3.4
80
11
7
mA
nA
UVLO
V EN_TH
I -SW
I -EN
θ JA
θ JC
Undervoltage Lockout
Shutdown Threshold Voltage
Enable Threshold Voltage
Switch Leakage
Enable Pin Current
Junction to Ambient
0 LFPM Air Flow (2)
Junction to Case (2)
VIN Rising
VIN Falling
See (1)
See (1)
V SW = 24V
Sink/Source
WSON and MSOP-PowerPAD Package
SOT-23 Package
WSON and MSOP-PowerPAD Package
SOT-23 Package
1.7
1.8
2.3
1.9
1.0
100
80
118
18
60
2.65
0.4
V
V
μA
nA
°C/W
°C/W
T SD
Thermal Shutdown Temperature (3)
Thermal Shutdown Hysteresis
160
10
°C
(1)
(2)
(3)
Do not allow this pin to float or be greater than V IN +0.3V.
Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.
Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device
Copyright ? 2007–2013, Texas Instruments Incorporated
Product Folder Links: LM2735
5
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