参数资料
型号: LM2735XSD/NOPB
厂商: National Semiconductor
文件页数: 17/58页
文件大小: 0K
描述: IC REG BOOST SEPIC ADJ 2.1A 6LLP
标准包装: 1
类型: 升压(升压),Sepic
输出类型: 可调式
输出数: 1
输出电压: 3 V ~ 24 V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 1.6MHz
电流 - 输出: 2.1A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
包装: 标准包装
供应商设备封装: 6-LLP-EP(3x3)
产品目录页面: 1299 (CN2011-ZH PDF)
配用: LM2735SD3.3EVAL-ND - BOARD EVALUATION FOR LM2735
其它名称: LM2735XSDDKR
SNVS485F – JUNE 2007 – REVISED APRIL 2013
Definitions
Heat energy is transferred from regions of high temperature to regions of low temperature via three basic
mechanisms: radiation, conduction and convection.
Radiation Electromagnetic transfer of heat between masses at different temperatures.
Conduction Transfer of heat through a solid medium.
Convection Transfer of heat through the medium of a fluid; typically air.
Conduction & Convection will be the dominant heat transfer mechanism in most applications.
R θ JC Thermal impedance from silicon junction to device case temperature.
R θ JA Thermal impedance from silicon junction to ambient air temperature.
C θ JC Thermal Delay from silicon junction to device case temperature.
C θ CA Thermal Delay from device case to ambient air temperature.
R θ JA & R θ JC These two symbols represent thermal impedances, and most data sheets contain associated values
for these two symbols. The units of measurement are °C/Watt.
R θ JA is the sum of smaller thermal impedances (see Figure 27 ). The capacitors represent delays that are present
from the time that power and its associated heat is increased or decreased from steady state in one medium until
the time that the heat increase or decrease reaches steady state on the another medium.
R T C - A
C T C - A
T C
R T J- CASE
C T J- CASE
T A
T J
Internal - P DISS
Figure 27. Simplified Thermal Impedance Model
The datasheet values for these symbols are given so that one might compare the thermal performance of one
package against another. In order to achieve a comparison between packages, all other variables must be held
constant in the comparison (PCB size, copper weight, thermal vias, power dissipation, V IN , V OUT , Load Current
etc). This does shed light on the package performance, but it would be a mistake to use these values to calculate
the actual junction temperature in your application.
R T JA =
T J - T A
P Dissipatio n
(17)
We will talk more about calculating the variables of this equation later, and how to eventually calculate a proper
junction temperature with relative certainty. For now we need to define the process of calculating the junction
temperature and clarify some common misconceptions.
R θ JA [Variables]:
?
?
?
?
Input Voltage, Output Voltage, Output Current, RDSon.
Ambient temperature & air flow.
Internal & External components power dissipation.
Package thermal limitations.
Copyright ? 2007–2013, Texas Instruments Incorporated
Product Folder Links: LM2735
17
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相关代理商/技术参数
参数描述
LM2735XSDX 制造商:NSC 制造商全称:National Semiconductor 功能描述:520kHz/1.6MHz - Space-Efficient Boost and SEPIC DC-DC Regulator
LM2735XSDX/NOPB 功能描述:直流/直流开关调节器 RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5
LM2735YMF 功能描述:直流/直流开关调节器 RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5
LM2735YMF/NOPB 功能描述:直流/直流开关调节器 SPACE-EFF BOOST AND SEPIC DC-DC REG RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5
LM2735YMFEVAL 功能描述:电源管理IC开发工具 LM2735YMF EVAL BOARD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V