参数资料
型号: LM2735YSD/NOPB
厂商: National Semiconductor
文件页数: 24/58页
文件大小: 0K
描述: IC REG BOOST SEPIC ADJ 2.1A 6LLP
标准包装: 1
类型: 升压(升压),Sepic
输出类型: 可调式
输出数: 1
输出电压: 3 V ~ 24 V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 520kHz
电流 - 输出: 2.1A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
包装: 标准包装
供应商设备封装: 6-LLP-EP(3x3)
产品目录页面: 1299 (CN2011-ZH PDF)
配用: LM2735SD3.3EVAL-ND - BOARD EVALUATION FOR LM2735
其它名称: LM2735YSDDKR
SNVS485F – JUNE 2007 – REVISED APRIL 2013
Example from previous calculations:
Pdiss = 475 mW
Ta @ Shutdown = 139°C
Tc @ Shutdown = 155°C
R T JA =
T J - T A
P Dissipatio n
: R < JC =
T J - T Case-Top
P Dissipatio n
(48)
R θ JA WSON = 55°C/W
R ψ JC WSON = 21°C/W
WSON & MSOP-PowerPAD typical applications will produce R θ JA numbers in the range of 50°C/W to 65°C/W,
and R ψ JC will vary between 18°C/W and 28°C/W. These values are for PCB’s with two and four layer boards with
0.5 oz copper, and four to six thermal vias to bottom side ground plane under the DAP.
For 5-pin SOT-23 package typical applications, R θ JA numbers will range from 80°C/W to 110°C/W, and R ψ JC will
vary between 50°C/W and 65°C/W. These values are for PCB’s with two & four layer boards with 0.5 oz copper,
with two to four thermal vias from GND pin to bottom layer.
Here is a good rule of thumb for typical thermal impedances, and an ambient temperature maximum of 75°C: If
your design requires that you dissipate more than 400mW internal to the LM2735, or there is 750mW of total
power loss in the application, it is recommended that you use the 6 pin WSON or the 8 pin MSOP-PowerPAD
package.
NOTE
NOTE: To use these procedures it is important to dissipate an amount of power within the
device that will indicate a true thermal impedance value. If one uses a very small internal
dissipated value, one can see that the thermal impedance calculated is abnormally high,
and subject to error. The graph below shows the nonlinear relationship of internal power
dissipation vs R θ JA .
500
450
400
350
300
250
200
150
100
50
0
0
0.1
0.2
0.3 0.4
0.5 0.6
0.7 0.8
P DISS
Figure 31. R θ JA vs Internal Dissipation for the WSON
and MSOP-PowerPAD Package
24
Product Folder Links: LM2735
Copyright ? 2007–2013, Texas Instruments Incorporated
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