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参数资料
| 型号： | LM3153MHX-2.5 |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 稳压器 |
| 英文描述： | SWITCHING CONTROLLER, 750 kHz SWITCHING FREQ-MAX, PDSO14 |
| 封装： | TSSOP-14 |
| 文件页数： | 9/20页 |
| 文件大小： | 479K |
| 代理商： | LM3153MHX-2.5 |
PCB Layout Considerations
It is good practice to layout the power components first, such
as the input and output capacitors, FETs, and inductor. The
first priority is to make the loop between the input capacitors
and the source of the low side FET to be very small and tie
the grounds of each directly to each other and then to the
ground plane through vias. As shown in the figure below,
when the input cap ground is tied directly to the source of the
low side FET, parasitic inductance in the power path, along
with noise coupled into the ground plane, are reduced.
The switch node is the next item of importance. The switch
node should be made only as large as required to handle the
load current. There are fast voltage transitions occurring in
the switch node at a high frequency, and if the switch node is
made too large it may act as an antennae and couple switch-
ing noise into other parts of the circuit. For high power designs
it is recommended to use a multi-layer board. The FET’s are
going to be the largest heat generating devices in the design,
and as such, care should be taken to remove the heat. On
multi layer boards using exposed-pad packages for the FET’s
such as the power-pak SO-8, vias should be used under the
FETs to the same plane on the interior layers to help dissipate
the heat and cool the FETs. For the typical single FET Power-
Pak type FETs the high-side FET DAP is Vin. The Vin plane
should be copied to the other interior layers to the bottom layer
for maximum heat dissipation. Likewise, the DAP of the low-
side FET is connected to the SW node and it’s shape should
be duplicated to the interior layers down to the bottom layer
for maximum heat dissipation.
See the Evaluation Board application note AN-1900 for an
example of a typical multilayer board layout, and the Demon-
stration Board Reference Design App Note for a typical 2 layer
board layout. Each design allows for single sided component
mounting.
30053258
FIGURE 5. Schematic of Parasitics
30053280
FIGURE 6. PCB Placement of Power Stage
17
www.national.com
LM3151/LM3152/LM3153
相关PDF资料 |
PDF描述 |
|---|---|
| LM3153MHE-2.5 | SWITCHING CONTROLLER, 750 kHz SWITCHING FREQ-MAX, PDSO14 |
| LM3152MH-5.0 | SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO14 |
| LM3151MHE-2.5 | SWITCHING CONTROLLER, 250 kHz SWITCHING FREQ-MAX, PDSO14 |
| LM3153MHE-5.0 | SWITCHING CONTROLLER, 750 kHz SWITCHING FREQ-MAX, PDSO14 |
| LM3151MHX-2.5 | SWITCHING CONTROLLER, 250 kHz SWITCHING FREQ-MAX, PDSO14 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LM3153MHX-3.3 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:SIMPLE SWITCHER? CONTROLLER, High Input Voltage Synchronous Step-Down |
| LM3153MHX-3.3/NOPB | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| LM316 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:OPERATIONAL AMPLIFIERS |
| LM316A | 制造商:NSC 制造商全称:National Semiconductor 功能描述:OPERATIONAL AMPLIFIERS |
| LM316AH | 制造商:NSC 制造商全称:National Semiconductor 功能描述:OPERATIONAL AMPLIFIERS |
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