参数资料
型号: LM324ADTBR2G
厂商: ON Semiconductor
文件页数: 4/14页
文件大小: 0K
描述: IC OPAMP QUAD SGL 32VDC 14-TSSOP
标准包装: 1
放大器类型: 通用
电路数: 4
转换速率: 0.6 V/µs
增益带宽积: 1MHz
电流 - 输入偏压: 45nA
电压 - 输入偏移: 2000µV
电流 - 电源: 1.4mA
电流 - 输出 / 通道: 40mA
电压 - 电源,单路/双路(±): 3 V ~ 32 V,±1.5 V ~ 16 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 剪切带 (CT)
其它名称: LM324ADTBR2GOSCT
LM324, LM324A, LM224, LM2902, LM2902V, NCV2902
http://onsemi.com
12
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE R
17
14
8
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010
CA
SIDE VIEW
M
14X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
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