参数资料
型号: LM4700DWF
厂商: NATIONAL SEMICONDUCTOR CORP
元件分类: 音频/视频放大
英文描述: 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC
封装: WAFER
文件页数: 6/19页
文件大小: 558K
代理商: LM4700DWF
Application Information (Continued)
ter than the required ±0.25 dB specified. This fact results in
a low and high frequency pole of 4 Hz and 100 kHz respec-
tively. As stated in the External Components section, R
I in
conjunction with C
I create a high-pass filter.
C
I ≥ 1/(2π * 1k * 4 Hz) = 39.8 F;
use 39 F.
The high frequency pole is determined by the product of the
desired high frequency pole, f
H, and the gain, AV. With a AV
= 21 and f
H = 100 kHz, the resulting GBWP of 2.1 MHz is
less than the minimum GBWP of 5 MHz for the LM4700. This
will ensure that the high frequency response of the amplifier
will be no worse than 0.17 dB down at 20 kHz which is well
within the bandwidth requirements of the design.
www.national.com
14
相关PDF资料
PDF描述
LM4700MWC 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC
LM4700T 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11
LM4700TF/NOPB 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11
LM4701MWC 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC
LM4730TA/NOPB 14 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM15
相关代理商/技术参数
参数描述
LM4700T 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:否 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Overture™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机,2-通道(立体声) 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C,麦克风,静音,短路保护,音量控制 安装类型:表面贴装 供应商设备封装:25-WLP(2.09x2.09) 封装/外壳:25-WFBGA,WLCSP 包装:带卷 (TR)
LM4700T/NOPB 制造商:Texas Instruments 功能描述:
LM4700TF 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11
LM4700TF 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11
LM4700TF/NOPB 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Overture™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机,2-通道(立体声) 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C,麦克风,静音,短路保护,音量控制 安装类型:表面贴装 供应商设备封装:25-WLP(2.09x2.09) 封装/外壳:25-WFBGA,WLCSP 包装:带卷 (TR)