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参数资料
| 型号： | LM4856LQ/NOPB |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1.5 W, 3 CHANNEL, AUDIO AMPLIFIER, QCC24 |
| 封装： | LLP-24 |
| 文件页数： | 8/23页 |
| 文件大小： | 1321K |
| 代理商： | LM4856LQ/NOPB |
Application Information (Continued)
TABLE 3. Volume Control
V4
V3
V2
V1
V0
Gain (dB)
G2
G1
R
IN,LIN
to
R
OUT,LOUT
P
HS
to
R
OUT,LOUT
00000
-34.5
-40.5
00001
-33.0
-39.0
00010
-31.5
-37.5
00011
-30.0
-36.0
00100
-28.5
-34.5
00101
-27.0
-33.0
00110
-25.5
-31.5
00111
-24.0
-30.0
01000
-22.5
-28.5
01001
-21.0
-27.0
01010
-19.5
-25.5
01011
-18.0
-24.0
01100
-16.5
-22.5
01101
-15.0
-21.0
01110
-13.5
-19.5
01111
-12.0
-18.0
10000
-10.5
-16.5
10001
-9.0
-15.0
10010
-7.5
-13.5
10011
-6.0
-12.0
10100
-4.5
-10.5
10101
-3.0
-9.0
10110
-1.5
-7.5
10111
0.0
-6.0
11000
1.5
-4.5
11001
3.0
-3.0
11010
4.5
-1.5
11011
6.0
0.0
11100
7.5
1.5
11101
9.0
3.0
11110
10.5
4.5
11111
12.0
6.0
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4856’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper area heatsink, copper traces, ground plane, and
finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.1W dissipation in a 8
load
at
≤ 1% THD+N. This high power is achieved through careful
consideration of necessary thermal design. Failing to opti-
mize thermal design may compromise the LM4856’s high
power performance and activate unwanted, though neces-
sary, thermal shutdown protection.
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 6 (3 X 2) (LD) vias. The via diameter
should be 0.012in - 0.013in with a 1.27mm pitch. Ensure
efficient thermal conductivity by plugging and tenting the vias
with plating and solder mask, respectively.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2 (min) area is
necessary for 5V operation with a 4
load. Heatsink areas
LM4856
www.national.com
16
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM4857 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:Stereo 1.2W Audio Sub-system with 3D Enhancement |
| LM4857_05 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:Stereo 1.2W Audio Sub-system with 3D Enhancement |
| LM4857GR | 功能描述:IC AUDIO SUBSYSTEM W/3D 49UBGA RoHS:否 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C，麦克风，静音，短路保护，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) |
| LM4857ITL | 制造商:Texas Instruments 功能描述:1.2W STEREO SUBSYST 3D SMD 4857 |
| LM4857ITL/NOPB | 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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