参数资料
型号: LM4873MTE/NOPB
厂商: NATIONAL SEMICONDUCTOR CORP
元件分类: 音频/视频放大
英文描述: 2.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20
封装: 6.50 X 4.40 MM, 0.90 MM HEIGHT, TSSOP-20
文件页数: 7/25页
文件大小: 963K
代理商: LM4873MTE/NOPB
Application Information (Continued)
mode has a distinct advantage over the single-ended con-
figuration: its differential output doubles the voltage swing
across the load. This produces four times the output power
when compared to a single-ended amplifier under the same
conditions. This increase in attainable output power as-
sumes that the amplifier is not current limited or that the
output signal is not clipped. To ensure minimum output sig-
nal clipping when choosing an amplifier’s closed-loop gain,
refer to the Audio Power Amplifier Design section.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
channel A’s and channel B’s outputs at half-supply. This
eliminates the coupling capacitor that single supply, single-
ended amplifiers require. Eliminating an output coupling ca-
pacitor in a single-ended configuration forces a single-supply
amplifier’s half-supply bias voltage across the load. This
increases internal IC power dissipation and may perma-
nently damage loads such as speakers.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful single-ended or bridged amplifier. Equation (2)
states the maximum power dissipation point for a single-
ended amplifier operating at a given supply voltage and
driving a specified output load.
P
DMAX =(VDD)
2/(2
π2R
L)
Single-Ended
(2)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is higher internal
power dissipation for the same conditions.
The LM4873 has two operational amplifiers per channel. The
maximum internal power dissipation per channel operating in
the bridge mode is four times that of a single-ended ampli-
fier. From Equation (3), assuming a 5V power supply and a
4
load, the maximum single channel power dissipation is
1.27W or 2.54W for stereo operation.
P
DMAX =4 * (VDD)
2/(2
π2R
L)
Bridge Mode
(3)
The LM4873’s power dissipation is twice that given by Equa-
tion (2) or Equation (3) when operating in the single-ended
mode or bridge mode, respectively. Twice the maximum
power dissipation point given by Equation (3) must not ex-
ceed the power dissipation given by Equation (4):
P
DMAX'=(TJMAX TA)/
θ
JA
(4)
The LM4873’s T
JMAX = 150C. In the LQ package soldered
to a DAP pad that expands to a copper area of 5in
2 on a
PCB, the LM4873’s
θ
JA is 20C/W. In the MTE and MTE-1
packages soldered to a DAP pad that expands to a copper
area of 2in
2 on a PCB, the LM4873’s
θ
JA is 41C/W. At any
given ambient temperature T
A, use Equation (4) to find the
maximum internal power dissipation supported by the IC
packaging. Rearranging Equation (4) and substituting P
DMAX
for P
DMAX' results in Equation (5). This equation gives the
maximum ambient temperature that still allows maximum
stereo power dissipation without violating the LM4873’s
maximum junction temperature.
T
A =TJMAX – 2*PDMAX
θ
JA
(5)
For a typical application with a 5V power supply and an 4
load, the maximum ambient temperature that allows maxi-
mum stereo power dissipation without exceeding the maxi-
mum junction temperature is approximately 99C for the LQ
package and 45C for the MTE and MTE-1 packages.
T
JMAX =PDMAX
θ
JA +TA
(6)
Equation (6) gives the maximum junction temperature
T
JMAX. If the result violates the LM4873’s 150C, reduce the
maximum junction temperature by reducing the power sup-
ply voltage or increasing the load resistance. Further allow-
ance should be made for increased ambient temperatures.
The above examples assume that a device is a surface
mount part operating around the maximum power dissipation
point. Since internal power dissipation is a function of output
power, higher ambient temperatures are allowed as output
power or duty cycle decreases.
If the result of Equation (2) is greater than that of Equation
(3), then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. If these
measures are insufficient, a heat sink can be added to
reduce
θ
JA. The heat sink can be created using additional
copper area around the package, with connections to the
ground pin(s), supply pin and amplifier output pins. External,
solder attached SMT heatsinks such as the Thermalloy
7106D can also improve power dissipation. When adding a
heat sink, the
θ
JA is the sum of
θ
JC,
θ
CS, and
θ
SA.(
θ
JC is the
junction-to-case thermal impedance,
θ
CS is the case-to-sink
thermal impedance, and
θ
SA is the sink-to-ambient thermal
impedance.) Refer to the Typical Performance Character-
istics curves for power dissipation information at lower out-
put power levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. Applications that employ a 5V regulator typically
use a 10 F in parallel with a 0.1 F filter capacitors to
stabilize the regulator’s output, reduce noise on the supply
line, and improve the supply’s transient response. However,
their presence does not eliminate the need for a local 1.0 F
tantalum bypass capacitance connected between the
LM4873’s supply pins and ground. Do not substitute a ce-
ramic capacitor for the tantalum. Doing so may cause oscil-
lation. Keep the length of leads and traces that connect
capacitors between the LM4873’s power supply pin and
ground as short as possible. Connecting a 1F capacitor,
C
B, between the BYPASS pin and ground improves the
internal bias voltage’s stability and improves the amplifier’s
PSRR. The PSRR improvements increase as the bypass pin
capacitor value increases. Too large, however, increases
turn-on time and can compromise amplifier’s click and pop
performance. The selection of bypass capacitor values, es-
pecially C
B, depends on desired PSRR requirements, click
and pop performance (as explained in the section, Selecting
Proper External Components), system cost, and size con-
straints.
MICRO-POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4873’s shutdown function. Activate micro-power shut-
down by applying V
DD to the SHUTDOWN pin. When active,
the LM4873’s micro-power shutdown feature turns off the
amplifier’s bias circuitry, reducing the supply current. The
logic threshold is typically V
DD/2. The low 0.7 A typical
shutdown current is achieved by applying a voltage that is as
near as V
DD as possible to the SHUTDOWN pin. A voltage
that is less than V
DD may increase the shutdown current.
Table 1 shows the logic signal levels that activate and deac-
tivate micro-power shutdown and headphone amplifier op-
eration.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a
LM4873
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相关代理商/技术参数
参数描述
LM4873MTEX 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
LM4873MTEX/NOPB 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
LM4873MTEX-1 功能描述:IC AMP AUDIO PWR 3W STER 28TSSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机,2-通道(立体声) 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C,麦克风,静音,短路保护,音量控制 安装类型:表面贴装 供应商设备封装:25-WLP(2.09x2.09) 封装/外壳:25-WFBGA,WLCSP 包装:带卷 (TR)
LM4873MTX 功能描述:IC AMP AUDIO PWR 3W STER 20TSSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机,2-通道(立体声) 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C,麦克风,静音,短路保护,音量控制 安装类型:表面贴装 供应商设备封装:25-WLP(2.09x2.09) 封装/外壳:25-WFBGA,WLCSP 包装:带卷 (TR)
LM4874 制造商:NSC 制造商全称:National Semiconductor 功能描述:2.1W Differential Input, BTL Output Stereo Audio Amplifier with Selectable Gain and Shutdown