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参数资料
| 型号： | LM6172AMWGFQMLV |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 音频／视频放大 |
| 英文描述： | LM6172 Dual High Speed, Low Power, Low Distortion, Voltage Feedback Amplifiers; Package: CERPACK; No of Pins: 16 |
| 中文描述： | 2 CHANNEL, VIDEO AMPLIFIER, CDSO16 |
| 封装： | CERAMIC, SOIC-16 |
| 文件页数： | 17/21页 |
| 文件大小： | 371K |
| 代理商： | LM6172AMWGFQMLV |
MICROCIRCUIT DATA SHEET
MNLM6172AM-X-RH REV 0A0
(Absolute Maximum Ratings)
(Note 1)
Supply Voltage (V+ - V-)
36V
Differential Input Voltage
(Note 6)
+10V
Maximum Junction Temperature
150 C
Power Dissipation
(Note 2, 3)
1.03W
Output Short Circuit to Ground
(Note 4)
Continuous
Operating Temperature Range
-55 C < Ta < +125 C
Storage Temperature Range
-65 C < Ta < +150 C
Thermal Resistance
(Note 7)
ThetaJA
100 C/W
8-Pin CERAMIC DIP (Still Air)
46 C/W
(500LF/Min Air flow)
124 C/W
CERAMIC SOIC
(Still Air)
74 C/W
(500LF/Min Air flow)
ThetaJC
(Note 3)
2 C/W
8-Pin CERAMIC DIP
6 C/W
CERAMIC SOIC
Package Weight
(Typical)
980mg
CERAMIC DIP
365mg
CERAMIC SOIC
ESD Tolerance
(Note 5)
4kV
Human Body Model
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Operating Ratings indicate conditions for which the device is functional, but do not
guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade
when the device is not operated under the listed test conditions.
Note 2:
The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to
ambient thermal resistance), and TA (ambient temperature). The maximum allowable
power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number
given in the Absolute Maximum Ratings, whichever is lower.
Note 3:
The package material for these devices allows much improved heat transfer over our
standard ceramic packages. In order to take full advantage of this improved heat
transfer, heat sinking must be provided between the package base (directly beneath
the die), and either metal traces on, or thermal vias through, the printed circuit
board. Without this additional heat sinking, device power dissipation must be
calculated using junction-to-ambient, rather than junction-to-case, thermal
resistance. It must not be assumed that the device leads will provide substantial
heat transfer out of the package, since the thermal resistance of the leadframe
material is very poor, relative to the material of the package base. The stated
junction-to-case thermal resistance is for the package material only, and does not
account for the additional thermal resistance between the package base and the
printed circuit board. The user must determine the value of the additional thermal
resistance and must combine this with the stated value for the package, to calculate
the total allowed power dissipation for the device.
5
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM6172AMWG-QML | 制造商:National Semiconductor Corporation 功能描述:OP Amp Dual Volt Fdbk ±18V/36V 16-Pin CPAK 制造商:National Semiconductor 功能描述:OP Amp Dual Volt Fdbk ±18V/36V 16-Pin CPAK |
| LM6172IM | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LM6172IM/NOPB | 功能描述:运算放大器 - 运放 Dual High Speed,Low Pwr Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LM6172IM/NOPB | 制造商:Texas Instruments 功能描述:Operational Amplifier (Op-Amp) IC |
| LM6172IMX | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
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