参数资料
型号: LM6181IM/NOPB
厂商: NATIONAL SEMICONDUCTOR CORP
元件分类: 音频/视频放大
英文描述: VIDEO AMPLIFIER, PDSO16
封装: SOP-16
文件页数: 24/28页
文件大小: 1928K
代理商: LM6181IM/NOPB
±5V AC Electrical Characteristics
The following specifications apply for Supply Voltage = ±5V, R
F = 820, and RL = 1k unless otherwise noted. Boldface
limits apply at the temperature extremes; all other limits T
J = 25C.
Symbol
Parameter
Conditions
LM6181AM
LM6181AI
LM6181I
Units
Typical
Limit
Typical
Limit
Typical
Limit
(Note 4)
(Note 5)
(Note 4)
(Note 5)
(Note 4)
(Note 5)
BW
Closed Loop Bandwidth 3 dB
AV = +2
50
MHz
min
AV = +10
40
AV = 1
55
35
55
35
55
35
AV = 10
35
PBW
Power Bandwidth
AV = 1, VO = 4VPP
40
SR
Slew Rate
AV = 1, VO = ±2V,
500
375
500
375
500
375
V/s
RL = 150 (Note 6)
min
ts
Settling Time (0.1%)AV = 1, VO = ±2V
50
ns
RL = 150
tr,tf
Rise and Fall Time
VO = 1VPP
8.5
tp
Propagation Delay Time
VO = 1VPP
88
8
in(+)
Non-Inverting Input Noise
f = 1 kHz
3
Current Density
in()
Inverting Input Noise
f = 1 kHz
16
Current Density
en
Input Noise Voltage
Density
f = 1 kHz
4
Second Harmonic Distortion
2 VPP, 10 MHz
45
dBc
Third Harmonic Distortion
2 VPP, 10 MHz
55
Differential Gain
RL = 150
AV = +2
0.063
%
NTSC
Differential Phase
RL = 150
AV = +2
0.16
Deg
NTSC
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to
be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see the Electrical
Characteristics.
Note 2: Human body model 100 pF and 1.5 k
.
Note 3: The typical junction-to-ambient thermal resistance of the molded plastic DIP(N) package soldered directly into a PC board is 102C/W. The
junction-to-ambient thermal resistance of the S.O. surface mount (M) package mounted flush to the PC board is 70C/W when pins 1, 4, 8, 9 and 16 are soldered
to a total 2 in2 1 oz. copper trace. The 16-pin S.O. (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V for proper operation. The typical
junction-to-ambient thermal resistance of the S.O. (M-8) package soldered directly into a PC board is 153C/W.
Note 4: Typical values represent the most likely parametric norm.
Note 5: All limits guaranteed at room temperature (standard type face) or at operating temperature extremes (bold face type).
Note 6: Measured from +25% to +75% of output waveform.
Note 7: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output cur-
rents in excess of ±130 mA over a long term basis may adversely affect reliability.
Note 8: For guaranteed Military Temperature Range parameters see RETS6181X.
www.national.com
5
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