参数资料
型号: LMR10510YSD/NOPB
厂商: National Semiconductor
文件页数: 4/26页
文件大小: 0K
描述: IC REG BUCK ADJ 1A 6LLP
标准包装: 1,000
系列: SIMPLE SWITCHER®
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.6 V ~ 4.5 V
输入电压: 3 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 3MHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 6-LLP-EP(3x3)

SNVS727B – OCTOBER 2011 – REVISED APRIL 2013
Electrical Characteristics (1) (2)
VIN = 5V unless otherwise indicated under the Conditions column. Limits in standard type are for T J = 25°C only; limits in
boldface type apply over the junction temperature (T J ) range of -40°C to +125°C. Minimum and Maximum limits are specified
through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T J = 25°C, and are
provided for reference purposes only.
Symbol
V FB
Δ V FB /V IN
I B
UVLO
Parameter
Feedback Voltage
Feedback Voltage Line Regulation
Feedback Input Bias Current
Undervoltage Lockout
Conditions
V IN = 3V to 5V
V IN Rising
V IN Falling
Min
0.588
1.85
Typ
0.600
0.02
0.1
2.73
2.3
Max
0.612
100
2.90
Units
V
%/V
nA
V
UVLO Hysteresis
0.43
V
F SW
D MAX
D MIN
R DS(ON)
I CL
V EN_TH
Switching Frequency
Maximum Duty Cycle
Minimum Duty Cycle
Switch On Resistance
Switch Current Limit
Shutdown Threshold Voltage
Enable Threshold Voltage
LMR10510-X
LMR10510-Y
LMR10510-X
LMR10510-Y
LMR10510-X
LMR10510-Y
WSON Package
SOT-23 Package
V IN = 3.3V
1.2
2.25
86
82
1.2
1.8
1.6
3.0
94
90
5
7
150
130
1.75
1.95
3.75
195
0.4
MHz
%
%
m ?
A
V
I SW
Switch Leakage
100
nA
I EN
Enable Pin Current
Sink/Source
100
nA
I Q
θ JA
θ JC
T SD
Quiescent Current (switching)
Quiescent Current (shutdown)
Junction to Ambient
0 LFPM Air Flow (3)
Junction to Case
Thermal Shutdown Temperature
LMR10510X V FB = 0.55
LMR10510Y V FB = 0.55
All Options V EN = 0V
WSON Package
SOT-23 Package
WSON Package
SOT-23 Package
3.3
4.3
30
80
118
18
80
165
5
6.5
mA
mA
nA
°C/W
°C/W
°C
(1)
(2)
(3)
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely parametric norm.
Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.
4
Product Folder Links: LMR10510
Copyright ? 2011–2013, Texas Instruments Incorporated
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