参数资料
型号: LMV1012UPX-25
厂商: NATIONAL SEMICONDUCTOR CORP
元件分类: 音频/视频放大
英文描述: Pre-Amplified IC’s for High Gain 2-Wire Microphones
中文描述: 1 CHANNEL, AUDIO PREAMPLIFIER, PBGA4
封装: 0.40 MM HEIGHT, LEAD FREE, MO-211CA, MICRO, SMD-4
文件页数: 14/15页
文件大小: 497K
代理商: LMV1012UPX-25
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTE: UNLESS OTHERWISE SPECIFIED.
1. TITANIUM COATING.
2. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA.
4-Bump ULTRA-Thin micro SMD
NS Package Number UPA04GKA
X
1
= 0.93 mm
X
2
= 1.006 mm
X
3
= 0.400 mm
L
www.national.com
14
相关PDF资料
PDF描述
LMV1012 Pre-Amplified IC’s for High Gain 2-Wire Microphones
LMV1012-07 Analog Pre-Amplified IC’s for High Gain Microphones
LMV1012-15 Pre-Amplified IC’s for High Gain 2-Wire Microphones
LMV1012-20 Pre-Amplified IC’s for High Gain 2-Wire Microphones
LMV1012-25 Pre-Amplified IC’s for High Gain 2-Wire Microphones
相关代理商/技术参数
参数描述
LMV1012UPX-25/NOPB 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
LMV1012XP-15 制造商:Texas Instruments 功能描述:Audio Amp Microphone 1-CH Mono Class-AB 4-Pin Micro SMD T/R
LMV1012XP-15/NOPB 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
LMV1012XP-25 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述:
LMV1012XP-25/NOPB 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel