参数资料
型号: LMV321SQ3T2G
厂商: ON Semiconductor
文件页数: 6/20页
文件大小: 0K
描述: IC OP AMP SGL LV R-R SC-70
标准包装: 3,000
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 1 V/µs
增益带宽积: 1MHz
电流 - 输入偏压: 1nA
电压 - 输入偏移: 1700µV
电流 - 电源: 130µA
电流 - 输出 / 通道: 160mA
电压 - 电源,单路/双路(±): 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-TSSOP(5 引线),SC-88A,SOT-353
供应商设备封装: SC-70-5
包装: 带卷 (TR)
其它名称: LMV321SQ3T2G-ND
LMV321SQ3T2GOSTR
LMV321, LMV358, LMV324
http://onsemi.com
14
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
L
1.25
1.55
M
0
10
S
2.50
3.00
12
3
54
S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
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