参数资料
型号: LMV324DTBR2G
厂商: ON Semiconductor
文件页数: 9/20页
文件大小: 0K
描述: IC OP AMP LOW VOLT R-R 14-TSSOP
标准包装: 2,500
放大器类型: 通用
电路数: 4
输出类型: 满摆幅
转换速率: 1 V/µs
增益带宽积: 1MHz
电流 - 输入偏压: 1nA
电压 - 输入偏移: 1700µV
电流 - 电源: 410µA
电流 - 输出 / 通道: 160mA
电压 - 电源,单路/双路(±): 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 带卷 (TR)
LMV321, LMV358, LMV324
http://onsemi.com
17
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
E
D
BOTTOM VIEW
b
e
8X
B
A
C
C NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
(A3)
0.05 C
C SEATING
PLANE
SIDE VIEW
L
8X
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.80 BSC
E
1.20 BSC
e
0.40 BSC
L
0.45
0.55
e/2
b2
0.30 REF
L1
0.00
0.03
L2
0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
7X
1
SOLDERMASK DEFINED
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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