参数资料
型号: LMV331SN3T1G
厂商: ON Semiconductor
文件页数: 7/20页
文件大小: 0K
描述: IC COMPARATOR SGL GP LV 5TSOP
标准包装: 3,000
类型: 通用
元件数: 1
输出类型: 开路漏极
电压 - 电源,单路/双路(±): 2.7 V ~ 5 V
电压 - 输入偏移(最小值): 9mV @ 5V
电流 - 输入偏压(最小值): 0.001µA @ 5V
电流 - 输出(标准): 84mA @ 5V
电流 - 静态(最大值): 150µA
传输延迟(最大): 1.5µs
封装/外壳: 6-TSOP(0.059",1.50mm 宽)5 引线
安装类型: 表面贴装
包装: 带卷 (TR)
其它名称: LMV331SN3T1G-ND
LMV331SN3T1GOSTR
LMV331, NCV331, LMV393, LMV339
http://onsemi.com
15
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
E
D
BOTTOM VIEW
b
e
8X
B
A
C
C NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
(A3)
0.05 C
C SEATING
PLANE
SIDE VIEW
L
8X
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.80 BSC
E
1.20 BSC
e
0.40 BSC
L
0.45
0.55
e/2
b2
0.30 REF
L1
0.00
0.03
L2
0.40 REF
DETAIL A
(L2)
(b2)
NOTE 5
L1
DETAIL A
M
0.10
M
0.05
0.22
0.32
8X
1.50
0.40 PITCH
0.66
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT*
7X
1
SOLDERMASK DEFINED
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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