参数资料
型号: LMV821M7/NOPB
厂商: National Semiconductor
文件页数: 18/38页
文件大小: 0K
描述: IC OP AMP RAIL/RAIL SC70-5
标准包装: 1
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 2 V/µs
增益带宽积: 5.6MHz
电流 - 输入偏压: 100nA
电压 - 输入偏移: 3500µV
电流 - 电源: 300µA
电流 - 输出 / 通道: 45mA
电压 - 电源,单路/双路(±): 2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-TSSOP(5 引线),SC-88A,SOT-353
供应商设备封装: SC-70-5
包装: 标准包装
产品目录页面: 1269 (CN2011-ZH PDF)
其它名称: LMV821M7DKR
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
LMV824MT/NOPB
ACTIVE
TSSOP
PW
14
94
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV824
MT
LMV824MTX
NRND
TSSOP
PW
14
2500
TBD
Call TI
-40 to 85
LMV824
MT
LMV824MTX/NOPB
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
LMV824
MT
LMV824MX
NRND
SOIC
D
14
2500
TBD
Call TI
-40 to 85
LMV824M
LMV824MX/NOPB
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LMV824M
LMV824Q1MA/NOPB
ACTIVE
SOIC
D
14
55
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV824Q1
MA
LMV824Q1MAX/NOPB
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV824Q1
MA
LMV824Q1MT/NOPB
ACTIVE
TSSOP
PW
14
94
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV824
Q1MT
LMV824Q1MTX/NOPB
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV824
Q1MT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
相关PDF资料
PDF描述
TLW-108-05-T-D CONN HEADER .100" 16POS DUAL TIN
SSQ-134-01-S-S CONN RCPT .100" 34POS SNGL GOLD
SSW-117-02-G-D-RA CONN RCPT .100" 34PS DL R/A GOLD
SSW-120-02-G-D CONN RCPT .100" 40POS DUAL GOLD
TSW-147-05-T-S CONN HEADER 47POS .100" SNGL TIN
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