参数资料
| 型号： | LMV824DR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 8/16页 |
| 文件大小： | 0K |
| 描述： | IC OP AMP R-R QUAD LP 14-SOIC |
| 标准包装： | 2,500 |
| 放大器类型： | 通用 |
| 电路数： | 4 |
| 输出类型： | 满摆幅 |
| 转换速率： | 2 V/µs |
| 增益带宽积： | 5.6MHz |
| 电流 - 输入偏压： | 119nA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 1mA |
| 电流 - 输出 / 通道： | 45mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 5.5 V，±1.35 V ~ 2.75 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOICN |
| 包装： | 带卷 (TR) |
LMV821, LMV822, LMV824
http://onsemi.com
16
PACKAGE DIMENSIONS
TSSOP14
CASE 948G
ISSUE B
DIM MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
1.20
0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60 0.020 0.024
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1
0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
___
_
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
V
14X
REF
K
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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For additional information, please contact your local
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