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参数资料
| 型号： | LMX2372SLBX |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | XO, clock |
| 英文描述： | PLLatinum⑩ Dual Frequency Synthesizer for RF Personal Communications |
| 中文描述： | PLL FREQUENCY SYNTHESIZER, 1200 MHz, CQCC24 |
| 封装： | 3.50 X 4.50 MM, 1 MM HEIGHT, CSP-24 |
| 文件页数： | 1/16页 |
| 文件大小： | 217K |
| 代理商： | LMX2372SLBX |
LMX2370/LMX2371/LMX2372
PLLatinum
Dual Frequency Synthesizer for RF
Personal Communications
LMX2370
LMX2371
LMX2372
2.5 GHz/1.2 GHz
2.0 GHz/1.2 GHz
1.2 GHz/1.2 GHz
General Description
The LMX237X family of monolithic, integrated dual fre-
quency synthesizers, including prescalers, is designed to be
used as a first and second local oscillator for dual mode or
dual conversion transceivers. It is fabricated using National’s
0.5u ABiCV silicon BiCMOS process. The LMX237X con-
tains two dual modulus prescalers. A 32/33 or a 16/17
prescaler can be selected for the 2.5 GHz and 2.0 GHz RF
synthesizers with the 16/17 prescaler rated for input frequen-
cies below 1.2 GHz. A 16/17 or an 8/9 prescaler can be se-
lected for the 1.2 GHz RF synthesizers with the 8/9 prescaler
rated for input frequencies below 550 MHz. Using a digital
phase locked loop technique, the LMX237X can generate
very stable, low noise control signals for UHF and VHF volt-
age controlled oscillators (VCO’s). Serial data is transferred
into the LMX237X via a 1.8V three wire interface (Data, En-
able, Clock) compatible with low voltage baseband proces-
sors. Supply voltage can range from 2.7V to 5.5V. The
LMX237X family features very low current consumption typi-
cally: LMX2370 - 6.0 mA
@
3V, LMX2371 - 5.0 mA
@
3V,
LMX2372 - 4.0 mA
@
3V.
The LMX237X are available in a 24-pad chip scale (CSP) or
a 20-pin TSSOP surface mount plastic package.
Features
n
2.7V–5.5V operation
n
Ultra low current consumption
n
Low phase detector noise floor
n
Low voltage MICROWIRE
interface (1.8V up to V
CC
)
n
Low prescaler values
32/33
@
f
IN
≤
2.5 GHz
16/17
@
f
IN
≤
1.2 GHz
8/9
@
f
IN
≤
550 MHz
n
Selectable charge pump current levels
n
Selectable FastLock
mode
n
Enhanced ESD protection
n
Small 24 pad chip scale package (3.5 x 4.5 x 1.0 mm)
Applications
n
Portable wireless communications (PCS/PCN, cordless)
n
Dual mode cellular telephone systems
n
Spread spectrum communication systems (CDMA)
n
Cable TV tuners (CATV)
Functional Block Diagram
FastLock
, PLLatinum
and MICROWIRE
are trademarks of National Semiconductor Corporation.
TRI-STATE
is a registered trademark of National Semiconductor Corporation.
DS101026-1
PRELIMINARY
March 1999
L
C
1999 National Semiconductor Corporation
DS101026
www.national.com
相关PDF资料 |
PDF描述 |
|---|---|
| LMX2372TMX | PLLatinum⑩ Dual Frequency Synthesizer for RF Personal Communications |
| LMX2372TM | PLLatinum⑩ Dual Frequency Synthesizer for RF Personal Communications |
| LMX2377UTMX | PLLatinum⑩ Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications |
| LMX2377UTM | Enclosed Switches Series LS: Side Rotary with 1.5" to 3.5" Adjustable Length Lever; Nylon Roller; 1NC 1NO SPDT Snap Action, Double Break; 0.5 in - 14NPT conduit; Plug-in |
| LMX2377USLBX | PLLatinum⑩ Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LMX2372TM | 制造商:NSC 制造商全称:National Semiconductor 功能描述:PLLatinum⑩ Dual Frequency Synthesizer for RF Personal Communications |
| LMX2372TMX | 功能描述:IC FREQ SYNTH DUAL 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:PLLatinum™ 标准包装:39 系列:- 类型:* PLL:带旁路 输入:时钟 输出:时钟 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 频率 - 最大:170MHz 除法器/乘法器:无/无 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:* 封装/外壳:* 供应商设备封装:* 包装:* |
| LMX2377U | 制造商:NSC 制造商全称:National Semiconductor 功能描述:PLLatinum⑩ Ultra Low Power Dual Frequency Synthesizer for RF Personal Communications |
| LMX2377U WAF | 制造商:Texas Instruments 功能描述: |
| LMX2377USLBX | 功能描述:IC FREQ SYNTH DUAL 24LAMINATECSP RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:PLLatinum™ 标准包装:39 系列:- 类型:* PLL:带旁路 输入:时钟 输出:时钟 电路数:1 比率 - 输入:输出:1:10 差分 - 输入:输出:是/是 频率 - 最大:170MHz 除法器/乘法器:无/无 电源电压:2.375 V ~ 3.465 V 工作温度:0°C ~ 70°C 安装类型:* 封装/外壳:* 供应商设备封装:* 包装:* |
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