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参数资料
| 型号： | LNK606DG-TL |
| 厂商： | Power Integrations |
| 文件页数： | 15/18页 |
| 文件大小： | 0K |
| 描述： | IC OFFLINE SWIT CV/CC HV 8SOIC |
| 标准包装： | 2,500 |
| 系列： | LinkSwitch®-II |
| 输出隔离： | 隔离 |
| 频率范围： | 59kHz ~ 73kHz |
| 输出电压： | 700V |
| 功率（瓦特）： | 6.1W |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽）7 引线 |
| 供应商设备封装： | SO-8C |
| 包装： | 带卷 (TR) |
LNK603-606/613-616
DIP-8C (P Package)
-E-
⊕ D S
.004 (.10)
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
.240 (6.10)
.260 (6.60)
Pin 1
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
-D-
.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
(NOTE 6)
.125 (3.18)
.145 (3.68)
.015 (.38)
MINIMUM
-T-
SEATING
PLANE
.120 (3.05)
.140 (3.56)
.008 (.20)
.015 (.38)
.100 (2.54) BSC
.014 (.36)
.022 (.56)
.048 (1.22) .137 (3.48)
⊕ T E D S .010 (.25) M
.053 (1.35) MINIMUM
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
P08C
PI-3933-101507
SMD-8C (G Package)
-E-
⊕ D S .004 (.10)
.046 .060
.060 .046
.080
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
.086
protrusions. Mold flash or
.240 (6.10)
.260 (6.60)
.372 (9.45)
.388 (9.86)
⊕ E S .010 (.25)
.186
.286
.420
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
4. Minimum metal to metal
Pin 1
Pin 1
spacing at the package body
for the omitted lead location
-D-
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.137 (3.48)
MINIMUM
Solder Pad Dimensions
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.
.057 (1.45)
.125 (3.18)
.145 (3.68)
.068 (1.73)
(NOTE 5)
.032 (.81)
.037 (.94)
.048 (1.22)
.053 (1.35)
.009 (.23)
.004 (.10)
.012 (.30)
.004 (.10)
.036 (0.91)
.044 (1.12)
0 ° - 8 °
G08C
PI-4015-101507
15
www.powerint.com
Rev. F 01/10
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相关代理商/技术参数 |
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| LNK606GG | 功能描述:交流/直流开关转换器 5.5 W (85-265 VAC) RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
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| LNK606PG | 功能描述:交流/直流开关转换器 85-265 VAC 5.5W LinkSwitch II RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
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