参数资料
型号: LPC1227FBD64/301,1
厂商: NXP Semiconductors
文件页数: 24/61页
文件大小: 0K
描述: MCU 32BIT 128K FLASH 8K 64-LQFP
产品培训模块: LPC1200 Series for Industrial Control
特色产品: LPC122x Cortex-M0 Microcontrollers
标准包装: 160
系列: LPC1200
核心处理器: ARM? Cortex?-M0
芯体尺寸: 32-位
速度: 45MHz
连通性: I²C,IrDA,Microwire,SPI,SSI,SSP,UART/USART
外围设备: 欠压检测/复位,DMA,POR,WDT
输入/输出数: 55
程序存储器容量: 128KB(128K x 8)
程序存储器类型: 闪存
RAM 容量: 8K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 3.6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 64-LQFP
包装: 托盘
其它名称: 568-5164
LPC1227FBD64/301
LPC122X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 26 August 2011
30 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
9.
Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
Tamb = ambient temperature (C),
Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j
a
+
=
Table 6.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC test board; no
air flow
LQFP64 package
-
61
-
C/W
LQFP48 package
86
-
C/W
Rth(j-c)
thermal resistance from
junction to case
JEDEC test board
LQFP64 package
-
19
-
C/W
LQFP48 package
36
-
C/W
Tj(max)
maximum junction
temperature
--150
C
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