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参数资料
| 型号： | LSM-1.5/10-D12-C |
| 厂商： | MURATA POWER SOLUTIONS INC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, SMT-6 |
| 文件页数： | 9/18页 |
| 文件大小： | 1583K |
| 代理商： | LSM-1.5/10-D12-C |
MDC_LSM 10A D12 Models.B01 Page 17 of 18
Technical enquiries email: sales@murata-ps.com, tel: +1 508 339 3000
www.murata-ps.com
Single Output
LSM-10A D12 Models
Non-Isolated, 12Vin, 0.75-5Vout DC/DC Converters
Figure 6. Reflow Solder Profile
HEAT SHIELD OUTSIDE TEMPERATURE
Sn96.5/Ag3.5 Melting Point
Sn63/Pb37 Melting Point
250
200
150
100
50
0
50
100
150
200
250
300
350
400
221
183
PCB TEMPERATURE INSIDE THE HEAT SHIELD
Te
mperature
(
C)
Time (Seconds)
Tape & Reel Surface Mount Package
Murata Power Solutions' LSM series DC/DC converters are the only higher-
current (10A) SMT DC/DC's that can be automatically "pick-and-placed" using
standard vacuum-pickup equipment (nozzle size and style, vacuum pressure
and placement speed may need to be optimized for automated pick and place)
and subsequently reflowed using high-temperature, lead-free solder.
Virtually all SMT DC/DCs today are unprotected "open-frame" devices
assembled by their vendors with high-temperature solder (usually Sn96.5/Ag3.5
with a melting point +221°C) so that you may attach them to your board using
low-temperature solder (usually Sn63/Pb37 with a melting point of +183°C).
Conceptually straightforward, this "stepped" solder approach has its limita-
tions, and it is clearly out of step with an industry trending toward the broad
use of lead-free solders. Are you to experiment and develop reflow profiles
from other vendors that ensure the components on those DC/DC never exceed
215-216°C? If those components get too hot, "double-reflow" could compro-
mise the reliability of their solder joints. Virtually all these devices demand you
"cool down" the Sn63 profile you are likely using today.
MPS is not exempted from the Laws of Physics. And we do not have magic
solders no one else has. We do have a simple and practical, straightforward
approach that works. We assemble our SMT DC/DC’s on a thermally-stable
plastic lead-frame (nylon 46, UL94V-0 flammability rated) using a high temper-
ature lead-free solder. In addition, the LSM is transitioning to RoHS (Reduction
of Hazardous Substances) construction and SAC 305 RoHS-approved solder.
The lead-frame ensures coplanarity (to within 0.004 in.) of the unit's copper
leads. These leads are gold-plated with a nickel underplate. See Mechanical
Data for additional information.
The disposable heat shield, with a cutaway exposing the package leads,
provides thermal insulation to internal components during reflow and doubles
as the vacuum pick-up location. The insulation properties of the heat shield are
so effective that temperature differentials as high as 50°C develop inside-to-
outside the shield. Oven temperature profiles with peaks of 250-260°C and
dwell times exceeding 2 minutes above 221°C are easily achieved. MPS's
new-generation SMT units are shipped in stackable, JEDEC-style plastic tray.
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