参数资料
型号: LT1009MH883
厂商: LINEAR TECHNOLOGY CORP
元件分类: 基准电压源/电流源
英文描述: 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, MBCY3
封装: METAL CAN, TO-46, 3 PIN
文件页数: 6/8页
文件大小: 118K
代理商: LT1009MH883
6
LT1009 Series
1009fd
H Package
2-Lead and 3-Lead TO-46 Metal Can
(LTC DWG # 05-08-1340)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
U
PACKAGE DESCRIPTIO
0.100
(2.540)
TYP
45
°
H02/03(TO-46) 1098
0.050
(1.270)
TYP
0.050
(1.270)
TYP
0.028 – 0.048
(0.711 – 1.219)
0.036 – 0.046
(0.914 – 1.168)
FOR 3-LEAD PACKAGE ONLY
0.016 – 0.021**
(0.406 – 0.533)
DIA
0.025
(0.635)
MAX
0.085 – 0.105
(2.159 – 2.667)
0.500
(12.700)
MIN
0.178 – 0.195
(4.521 – 4.953)
0.209 – 0.219
(5.309 – 5.537)
REFERENCE
PLANE
*
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
PIN 1
OBSOLETE PACKAGE
MSOP (MS8) 0204
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127
± 0.076
(.005
± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193
± .006)
8
7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
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