参数资料
| 型号： | LT1010CN8 |
| 厂商： | Linear Technology |
| 文件页数： | 7/20页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER HI-SPEED 150MA 8-DIP |
| 标准包装： | 50 |
| 放大器类型： | 缓冲器 |
| 电路数： | 1 |
| 转换速率： | 75 V/µs |
| 增益带宽积： | 20MHz |
| 电流 - 输入偏压： | 500µA |
| 电流 - 电源： | 5mA |
| 电流 - 输出 / 通道： | 150mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 40 V，±2.25 V ~ 20 V |
| 工作温度： | 0°C ~ 100°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
LT1010
15
1010fe
APPLICATIONS INFORMATION
Typical thermal calculations for the miniDIP package are
detailed in the following paragraphs.
For 4.8mA supply current (typical at 50°C, 30V supply
voltage—see supply current graphs) to the LT1010 at
±15V, PD = power dissipated in the part is equal to:
(30V)(0.0048A) = 0.144W
The rise in junction is then:
(0.144W)(100°C/W—This is
θJA for the N package)
= 14.4°C.
This means that the junction temperature in 50°C ambient
air without driving any current into a load is:
14.4°C + 50°C = 64.4°C
Using the LT1010 to drive 8V DC into a 200Ω load using
±15V power supplies dissipates PD in the LT1010 where:
PD =
V+ – VOUT
(
) V
OUT
(
)
RL
=
15V – 8V
(
) 8V
( )
200
= 0.280W
ThiscausestheLT1010junctiontemperaturetoriseanother
(0.280W)(100°C/W) = 28°C.
This heats the junction to 64.4°C + 28°C = 92.4°C.
An example of 1MHz operation further shows the limita-
tions of the N (or miniDIP) package. For ±15V operation:
PD at IL = 0 at 1MHz* = (10mA)(30V) = 0.30W
This power dissipation causes the junction to heat from
50°C(ambientinthisexample)to50°C+(0.3W)(100°C/W)
= 80°C. Driving 2VRMS of 1MHz signal into a 200Ω load
causes an additional
PD =
2V
200
15 – 2
(
)=0.130W
to be dissipated, resulting in another (0.130W)(100°C/W)
= 13°C rise in junction temperature to 80°C + 13°C = 93°C.
Thermal Resistance of DFN Package
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. DFN Measured Thermal Resistance
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE
BACKSIDE
2500 sq mm 2500 sq mm 2500 sq mm
40°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm 2500 sq mm 2500 sq mm
50°C/W
100 sq mm 2500 sq mm 2500 sq mm
62°C/W
For the DFN package, the thermal resistance junction-to-
case (
θJC), measured at the Exposed Pad on the back of
the die, is 7.5°C/W.
Continuous operation at the maximum supply voltage
and maximum load current is not practical due to thermal
limitations. Transient operation at the maximum supply
is possible. The approximate thermal time constant for a
2500sq mm 3/32" FR-4 board with maximum topside and
backside area for one ounce copper is 3 seconds. This
time constant will increase as more thermal mass is added
(i.e., vias, larger board and other components).
Foranapplicationwithtransienthighpowerpeaks,average
power dissipation can be used for junction temperature
calculationsaslongasthepulseperiodissignificantlyless
than the thermal time constant of the device and board.
*See Supply Current vs Frequency graph.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1010CN8#PBF | 功能描述:IC BUFFER HI-SPEED 150MA 8-DIP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:MicroAmplifier™ 放大器类型:通用 电路数:4 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:5pA 电压 - 输入偏移:1500µV 电流 - 电源:220µA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商设备封装:14-SOIC 包装:剪切带 (CT) 其它名称:296-29363-1 |
| LT1010CN8#PBF | 制造商:Linear Technology 功能描述:Buffer IC 制造商:Linear Technology 功能描述:IC, POWER BUFFER, SINGLE, 20MHZ, DIP-8 |
| LT1010CN8PBF | 制造商:Linear Technology 功能描述:Op Amp General Purpose +/-22V/44V PDIP8 |
| LT1010CT | 功能描述:IC BUFFER HI-SPEED 150MA TO220-5 RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 放大器类型:电流检测 电路数:1 输出类型:- 转换速率:- 增益带宽积:125kHz -3db带宽:- 电流 - 输入偏压:- 电压 - 输入偏移:100µV 电流 - 电源:1.1µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:4-WFBGA，CSPBGA 供应商设备封装:4-UCSP（2x2） 包装:剪切带 (CT) 其它名称:MAX9634WERS+TCT |
| LT1010CT#06 | 制造商:Linear Technology 功能描述:Fast +/ 150 mA power buffer |
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