LT1010
3
1010fe
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (See Note 4. Typical values in curves.)
SYMBOL
PARAMETER
CONDITIONS (Note 4)
MIN
TYP
MAX
UNITS
VOS
Output Offset Voltage
(Note 4)
l
0
–20
150
220
mV
VS = ±15V, VIN = 0V
20
100
mV
IB
Input Bias Current
IOUT = 0mA
IOUT ≤ 150mA
l
0
250
500
800
A
AV
Large-Signal Voltage Gain
l
0.995
1.00
V/V
ROUT
Output Resistance
IOUT = ±1mA
IOUT = ±150mA
l
5
10
12
Ω
Slew Rate
VS = ±15V, VIN = ±10V, VOUT = ±8V, RL = 100Ω
75
V/s
VSOS+
Positive Saturation Offset
IOUT = 0 (Note 5)
l
1.0
1.1
V
VSOS–
Negative Saturation Offset
IOUT = 0 (Note 5)
l
0.2
0.3
V
RSAT
Saturation Resistance
IOUT = ±150mA (Note 5)
l
22
28
Ω
VBIAS
Bias Terminal Voltage
RBIAS = 20Ω (Note 6)
l
700
560
840
880
mV
IS
Supply Current
IOUT = 0, IBIAS = 0
l
9
10
mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Dissipation must be based on a thermal resistance. See
Application Information for power dissipation.
Note 3: In current limit or thermal limit, input current increases sharply
with input-output differentials greater than 8V; so input current must be
limited. Input current also rises rapidly for input voltages 8V above V+ or
0.5V below V–.
Note 4: Specifications apply for 4.5V ≤ VS ≤ 40V,
V– + 0.5V ≤ VIN ≤ V+ – 1.5V and IOUT = 0, unless otherwise stated.
Temperature range is 0°C ≤ TC ≤ 100°C.
Note 5: The output saturation characteristics are measured with 100mV
output clipping. See Applications Information for determining available
output swing and input drive requirements for a given load.
Note 6: The output stage quiescent current can be increased by connecting
a resistor between the BIAS pin and V+. The increase is equal to the bias
terminal voltage divided by this resistance.
Note 7: Thermal resistance varies depending upon the amount of PC board
metal attached to the pin (Pin 9) of the device.
θJA is specified for a certain
amount of 1oz copper metal trace connecting to Pin 9 as described in the
thermal resistance tables in the Applications Information section.