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参数资料
| 型号： | LT1018IS8#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 4/16页 |
| 文件大小： | 0K |
| 描述： | IC COMPARATOR MICRPWR DUAL 8SOIC |
| 标准包装： | 100 |
| 类型： | 通用 |
| 元件数： | 2 |
| 输出类型： | 上拉 |
| 电压 - 电源，单路/双路(±)： | 1.1 V ~ 40 V，±0.55 V ~ 20 V |
| 电压 - 输入偏移（最小值）： | 1mV @ ±20V |
| 电流 - 输入偏压（最小值）： | 0.075µA @ ±20V |
| 电流 - 输出（标准）： | 70mA @ 4.5V |
| 电流 - 静态（最大值）： | 250µA |
| CMRR, PSRR（标准）： | 115dB CMRR，110dB PSRR |
| 传输延迟（最大）： | 6µs |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 安装类型： | 表面贴装 |
| 包装： | 管件 |
LT1017/LT1018
12
10178ff
PACKAGE DESCRIPTION
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
OBSOLETE PACKAGE
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°
H8(TO-5) 0.200 PCD 0204
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
OBSOLETE PACKAGE
.050
(1.270)
MAX
.016 – .021**
(0.406 – 0.533)
.010 – .045*
(0.254 – 1.143)
SEATING
PLANE
.040
(1.016)
MAX
.165 – .185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
.500 – .750
(12.700 – 19.050)
.305 – .335
(7.747 – 8.509)
.335 – .370
(8.509 – 9.398)
DIA
.200
(5.080)
TYP
.027 – .045
(0.686 – 1.143)
.028 – .034
(0.711 – 0.864)
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
45°
H8(TO-5) 0.200 PCD 0204
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
.016 – .024
(0.406 – 0.610)
*
**
PIN 1
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