参数资料
| 型号： | LT1086IM-3.3#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V 1.5A 3DD |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 50 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 20V |
| 电压 - 压降（标准）： | 1.3V @ 1.5A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A |
| 电流 - 限制（最小）： | 1.5A |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-4，D²Pak（3 引线+接片），TO-263AA |
| 供应商设备封装： | D2PAK-3 |
| 包装： | 管件 |
| 产品目录页面： | 1325 (CN2011-ZH PDF) |
LT1086 Series
APPLICATIO N S I N FOR M ATIO N
In both cases the junction temperature is below the
maximum rating for the respective sections, ensuring
reliable operation.
Junction-to-case thermal resistance for the K and T pack-
ages is specified from the IC junction to the bottom of the
case directly below the die. This is the lowest resistance
path for heat flow. While this is also the lowest resistance
path for the H package, most available heat sinks for this
package are of the clip-on type that attach to the cap of the
package. The data sheet specification for thermal resis-
tance for the H package is therefore written to reflect this.
In all cases proper mounting is required to ensure the best
possible heat flow from the die to the heat sink. Thermal
compound at the case-to-heat sink interface is strongly
recommended. In the case of the H package, mounting the
device so that heat can flow out the bottom of the case will
significantly lower thermal resistance ( ≈ a factor of 2). If
the case of the device must be electrically isolated, a
thermally conductive spacer can be used as long as its
added contribution to thermal resistance is considered.
Note that the case of all devices in this series is electrically
connected to the output.
TYPICAL APPLICATIO N S
5V, 1.5A Regulator
V IN ≥ 6.5V
IN
LT1086
OUT
5V AT 1.5A
+
10 μ F
ADJ
121 ?
1%
+
10 μ F*
TANTALUM
365 ?
1%
LT1086 ? AI02
*REQUIRED FOR STABILITY
SCSI-2 Active Termination
TERMPWR
1N5817
IN LT1086-2.85 OUT
GND
110 ?
2%
110 ?
4.25V
TO 5.25V
+
10 μ F
TANTALUM
+
10 μ F
TANTALUM
0.1 μ F
CERAMIC
110 ?
2%
110 ?
18 TOTAL
110 ?
2%
110 ?
LT1086 ? TA03
sn1086 1086ffs
11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1086IMPBF | 制造商:Linear Technology 功能描述:LDO Regulator Positive 1.5A DDPAK4 |
| LT1086IT | 功能描述:IC REG LDO ADJ 1.5A TO220 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:800 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:最高 16V 电压 - 压降（标准）:0.7V @ 4A 稳压器数量:1 电流 - 输出:4A 电流 - 限制（最小）:4.2A 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6，D²Pak（5 引线+接片），TO-263BA 供应商设备封装:TO-263-5 包装:带卷 (TR) 其它名称:AP1184K525L-13AP1184K525LDITR |
| LT1086IT#32 | 制造商:Linear Technology 功能描述: |
| LT1086IT#36PBF | 制造商:Linear Technology 功能描述:IC REG LDO ADJ 1.5A TO220-3 |
| LT1086IT#PBF | 功能描述:IC REG LDO ADJ 1.5A TO220 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:8V 输入电压:10.5 V ~ 23 V 电压 - 压降（标准）:1.7V @ 40mA 稳压器数量:1 电流 - 输出:100mA（最小值） 电流 - 限制（最小）:- 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:剪切带 (CT) 产品目录页面:1075 (CN2011-ZH PDF) 其它名称:296-24390-1 |
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