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参数资料
| 型号： | LT1124AIS8-1#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP DUAL PREC HS LN 8SOIC |
| 标准包装： | 100 |
| 放大器类型： | 通用 |
| 电路数： | 2 |
| 转换速率： | 4.5 V/µs |
| 增益带宽积： | 12.5MHz |
| 电流 - 输入偏压： | 5nA |
| 电压 - 输入偏移： | 20µV |
| 电流 - 电源： | 2.3mA |
| 电压 - 电源，单路/双路(±)： | ±4 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
LT1124/LT1125
18
11245ff
For more information www.linear.com/LT1124
package DescripTion
SW Package
16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
S16 (WIDE) 0502
NOTE 3
.398 – .413
(10.109 – 10.490)
NOTE 4
16 15 14 13 12 11 10
9
1
N
2
3
4
5
6
7
8
N/2
.394 – .419
(10.007 – 10.643)
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.005
(0.127)
RAD MIN
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.420
MIN
.325 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
N
1
2
3
N/2
.050 BSC
.030 ±.005
TYP
SW Package
16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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| LT1124AMPS8#PBF | 功能描述:IC OPAMP DUAL PREC HS LN 8-SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源，单路/双路(±):4.5 V ~ 38 V，±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
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