参数资料
型号: LT1175CT-5#PBF
厂商: Linear Technology
文件页数: 16/20页
文件大小: 0K
描述: IC REG LDO -5V .5A TO220
标准包装: 50
稳压器拓扑结构: 负,固定式
输出电压: -5V
输入电压: 可下调至 -20V
电压 - 压降(标准): 0.5V @ 500mA
稳压器数量: 1
电流 - 输出: 500mA
电流 - 限制(最小): 可调式
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: TO-220-5 成形引线
供应商设备封装: TO-220-5
包装: 管件
产品目录页面: 1326 (CN2011-ZH PDF)
LT1175
PACKAGE DESCRIPTION
Q Package
5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461)
.060
(1.524)
.390 – .415
.256
(6.502)
.060
(1.524)
TYP
(9.906 – 10.541)
.165 – .180
(4.191 – 4.572)
.045 – .055
15 ° TYP
(1.143 – 1.397)
.004 –.004
(
0.102 –0.102
.060
(1.524)
.183
(4.648)
.330 – .370
(8.382 – 9.398)
.059
(1.499)
TYP
+.008
+0.203
)
.095 – .115
.075
(1.905)
(2.413 – 2.921)
.143 –.020
(
3.632 –0.508
.028 – .038
.300
(7.620)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
+.012
+0.305
)
.067
(1.702)
BSC
(0.711 – 0.965)
TYP
.013 – .023
(0.330 – 0.584)
.050 ± .012
(1.270 ± 0.305)
Q(DD5) 0502
.420
.350
.090
.565
.080
.205
.320
.420
.276
.325
.090
.565
.067
.042
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
1175ff
16
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