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| 型号： | LT1313CS |
| 厂商： | Linear Technology |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC DRV/REG PCMCIA VPP DUAL16SOIC |
| 标准包装： | 50 |
| 应用： | PCMCIA 驱动器/稳压器，PCMCIA 卡槽 |
| 输入电压： | 13 V ~ 20 V |
| 输出数： | 2 |
| 输出电压： | 3.3V，5V，12V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
| 其它名称： | LT1313CS8 LT1313CS8-ND |
LT1313
APPLICATIO N S I N FOR M ATIO N
THERMAL RESISTANCE
The fall time from 12V to 0V is set by the output capacitor
and an internal pull-down current source which sinks
about 30mA. This source will fully discharge a 1 μ F capaci-
tor in less than 1ms.
Thermal Considerations
Power dissipated by the device is the sum of two compo-
nents: output current multiplied by the input-output differ-
ential voltage: I OUT × (V IN – V OUT ), and ground pin current
multiplied by supply voltage: (I GND × V IN ).
The ground pin current can be found by examining the
Ground Pin Current curves in the Typical Performance
Characteristics section.
Heat sinking, for surface mounted devices, is accom-
plished by using the heat spreading capabilities of the PC
board and its copper traces.
The junction temperature of the LT1313 must be limited to
125 ° C to ensure proper operation. Use Table 1, in con-
junction with the typical performance graphs, to calculate
the power dissipation and die temperature for a particular
application and ensure that the die temperature does not
exceed 125 ° C under any operating conditions.
Table 1. 16-Pin SO Package*
COPPER AREA
TOPSIDE BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
Calculating Junction Temperature
Example: given an output voltage of 12V, an input supply
voltage of 14V, and an output current of 100mA (one VPP
output), and a maximum ambient temperature of 50 ° C,
what will the maximum junction temperature be?
Power dissipated by the device will be equal to:
I OUT × (V S – VPP OUT ) + (I GND × V IN )
where,
I OUT = 100mA
V IN = 14V
I GND at (I OUT = 100mA, V IN = 14V) = 5mA
so,
P D = 100mA × (14V –12V) + (5mA × 15V) = 0.275W
Using Table 1, the thermal resistance will be in the range
of 120 ° C/W to 131 ° C/W depending upon the copper area.
So the junction temperature rise above ambient will be
less than or equal to:
0.275W × 131 ° C/W = 36 ° C
The maximum junction temperature will then be equal to
the junction temperature rise above ambient plus the
maximum ambient temperature or:
T JMAX = 50 ° C + 36 ° C = 86 ° C
2500 sq mm
1000 sq mm
225 sq mm
1000 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
1000 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
1000 sq mm
120 ° C/W
120 ° C/W
125 ° C/W
131 ° C/W
For more detailed applications information, see the LT1312
Single PCMCIA VPP Driver/Regulator data sheet.
* Device is mounted on topside.
7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1313CS#PBF | 功能描述:IC DRV/REG PCMCIA VPP DL 16SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| LT1313CS#TR | 功能描述:IC DRIVER/REG VPP PCMCIA 16SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 标准包装:43 系列:- 应用:控制器，Intel VR11 输入电压:5 V ~ 12 V 输出数:1 输出电压:0.5 V ~ 1.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-QFN（7x7） 包装:管件 |
| LT1313CS#TRPBF | 功能描述:IC DRV/REG PCMCIA VPP DL 16SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| LT1316 | 制造商:LINER 制造商全称:Linear Technology 功能描述:Constant-Current/ Constant-Voltage 1.4MHz Step-Up DC/DC Converter |
| LT1316CMS8 | 功能描述:IC REG BST FLYBK ADJ 0.5A 8MSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:升压（升压） 输出类型:可调式 输出数:1 输出电压:1.24 V ~ 30 V 输入电压:1.5 V ~ 12 V PWM 型:电流模式，混合 频率 - 开关:600kHz 电流 - 输出:500mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:8-SOIC |
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