参数资料
型号: LT1460GIZ-2.51460
厂商: LINEAR TECHNOLOGY CORP
元件分类: 基准电压源/电流源
英文描述: 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 2.5 V, PBCY3
封装: PLASTIC, TO-226, TO-92, 3 PIN
文件页数: 10/24页
文件大小: 509K
代理商: LT1460GIZ-2.51460
LT1460
18
1460f
APPLICATIO S I FOR ATIO
WU
U
Input Capacitance
It is recommended that a 0.1F or larger capacitor be
added to the input pin of the LT1460. This can help with
stability when large load currents are demanded.
Output Accuracy
Like all references, either series or shunt, the error budget of
the LT1460-2.5 is made up of primarily three components:
initial accuracy, temperature coefcient and load regulation.
Line regulation is neglected because it typically contrib-
utes only 30ppm/V, or 75V for a 1V input change. The
LT1460-2.5 typically shifts less than 0.01% when soldered
into a PCB, so this is also neglected (see PC Board Layout
section). The output errors are calculated as follows for a
100A load and 0°C to 70°C temperature range:
LT1460AC
Initial accuracy = 0.075%
For IO = 100A, and using the LT1460-2.5 for calculation,
V
ppm
mA
V
OUT =
()(
)=
3500
01
25
875
..
which is 0.035%.
For temperature 0°C to 70°C the maximum ΔT = 70°C,
V
ppm
C
CV
mV
OUT =
°
°
()( )=
10
70
25
175
..
which is 0.07%.
Total worst-case output error is:
0.075% + 0.035% + 0.070% = 0.180%.
Table 1 gives worst-case accuracy for the LT1460AC, CC,
DC, FC, GC from 0°C to 70°C and the LT1460BI, EI, GI
from –40°C to 85°C.
Note that the LT1460-5 and LT1460-10 give identical ac-
curacy as a fraction of their respective output voltages.
PC Board Layout
In 13- to 16-bit systems where initial accuracy and tem-
perature coefcient calibrations have been done, the me-
chanical and thermal stress on a PC board (in a cardcage
for instance) can shift the output voltage and mask the
true temperature coefcient of a reference. In addition,
the mechanical stress of being soldered into a PC board
can cause the output voltage to shift from its ideal value.
Surface mount voltage references (MS8 and S8) are the
most susceptible to PC board stress because of the small
amount of plastic used to hold the lead frame.
A simple way to improve the stress-related shifts is to
mount the reference near the short edge of the PC board,
or in a corner. The board edge acts as a stress boundary,
or a region where the exure of the board is minimum.
The package should always be mounted so that the leads
absorb the stress and not the package. The package is
generally aligned with the leads parallel to the long side
of the PC board as shown in Figure 16a.
A qualitative technique to evaluate the effect of stress on
voltage references is to solder the part into a PC board and
Table 1. Worst-Case Output Accuracy Over Temperature
IOUT
LT1460AC
LT1460BI
LT1460CC
LT1460DC
LT1460EI
LT1460FC
LT1460GC
LT1460GI
LT1460HC
LT1460JC
LT1460KC
0
0.145%
0.225%
0.205%
0.240%
0.375%
0.325%
0.425%
0.562%
0.340%
0.540%
0.850%
100A
0.180%
0.260%
0.240%
0.275%
0.410%
0.360%
0.460%
0.597%
0.380%
0.580%
0.890%
10mA
0.325%
0.405%
0.385%
0.420%
0.555%
0.505%
0.605%
0.742%
0.640%
0.840%
1.15%
20mA
0.425%
N/A
0.485%
0.520%
N/A
0.605%
0.705%
N/A
0.540%
0.740%
1.05%
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