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参数资料
| 型号： | LT1510IGN |
| 厂商： | Linear Technology |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC BATT CHARGER CONST V/I 16SSOP |
| 标准包装： | 100 |
| 功能： | 充电管理 |
| 电池化学： | 锂离子，镍镉，镍氢 |
| 电源电压： | 6.2 V ~ 28 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SSOP |
| 包装： | 管件 |
LT1510/LT1510-5
APPLICATIO N S I N FOR M ATIO N
( ) . 8 4
[ ] 2 1 )( . ) = 0 . 17 W
( )( ) . 8 4 ? ? 1 + 8 30 . 4 ? ?
1 . 2
55 ( )
( 1 . 2 ) ( 0 . 35 )( 8 . 4 ) +
( )( )( )
? 10 ? 10 15 1 . 2 200 kHz
= = 14 mA
Example: V IN = 15V, V BAT = 8.4V, I BAT = 1.2A;
P BIAS = ( 3 . 5 mA )( 15 ) + 1 . 5 mA ( 8 . 4 )
2
+ 15 7 . 5 mA + ( 0 . 012
2 ? ?
P DRIVER = = 0 . 13 W
15
2
P SW =
15
? 9 ?
? ?
= 0 . 28 + 0 . 04 = 0 . 32 W
The average I VX required is:
P DRIVER 0 . 045W
V X 3 . 3 V
Total board area becomes an important factor when the
area of the board drops below about 20 square inches. The
graph in Figure 9 shows thermal resistance vs board area
for 2-layer and 4-layer boards. Note that 4-layer boards
have significantly lower thermal resistance, but both types
show a rapid increase for reduced board areas. Figure 10
shows actual measured lead temperature for chargers
operating at full current. Battery voltage and input voltage
will affect device power dissipation, so the data sheet
power calculations must be used to extrapolate these
readings to other situations.
Vias should be used to connect board layers together.
( )( )
P SENSE = 0 . 18 1 . 2
Total power in the IC is:
2
= 0 . 26 W
Planes under the charger area can be cut away from the
rest of the board and connected with vias to form both a
0.17 + 0.13 + 0.32+ 0.26 = 0.88W
C1
SW
LT1510
Temperature rise will be (0.88W)(50 ° C/W) = 44 ° C. This
assumes that the LT1510 is properly heat sunk by con-
L1
D2
BOOST
SENSE
necting the four fused ground pins to the expanded traces
and that the PC board has a backside or internal plane for
V X
I VX
+
10 μ F
1510 F07
heat spreading.
The P DRIVER term can be reduced by connecting the boost
diode D2 (see Figures 2 and 6 circuits) to a lower system
voltage (lower than V BAT ) instead of V BAT (see Figure 8).
Then,
60
55
Figure 8
( )( )( )
V X ? 1 + X ?
?
30 ?
P DRIVER
=
? V ?
I BAT V BAT
55 ( V IN )
50
45
40
35
2-LAYER BOARD
4-LAYER BOARD
For example, V X = 3.3V,
30
S16, MEASURED FROM AIR AMBIENT
TO DIE USING COPPER LANDS AS
SHOWN ON DATA SHEET
( )( )( )
1 . 2 A 8 . 4 V 3 . 3 V ? 1 +
P DRIVER
=
?
?
55 ( 15 V )
3 . 3 V ?
30 ? ?
= 0 . 045 W
25
0 5 10 15 20 25 30 35
BOARD AREA (IN 2 )
1510 F08
Figure 9. LT1510 Thermal Resistance
13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1510IGN#PBF | 功能描述:IC BATT CHARGER CONST V/I 16SSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 功能:电池监控器 电池化学:碱性，锂离子，镍镉，镍金属氢化物 电源电压:1 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-6 包装:带卷 (TR) |
| LT1510IGN#TR | 功能描述:IC CHARGER BATT CONST V/I 16SSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 电池管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 功能:电池监控器 电池化学:碱性，锂离子，镍镉，镍金属氢化物 电源电压:1 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-6 包装:带卷 (TR) |
| LT1510IGN#TRPBF | 功能描述:IC BATT CHARGER CONST V/I 16SSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 功能:电池监控器 电池化学:碱性，锂离子，镍镉，镍金属氢化物 电源电压:1 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-6 包装:带卷 (TR) |
| LT1510IN | 功能描述:IC BATT CHARGER CONST V/I 16-DIP RoHS:否 类别:集成电路 (IC) >> PMIC - 电池管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 功能:电池监控器 电池化学:碱性，锂离子，镍镉，镍金属氢化物 电源电压:1 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-6 包装:带卷 (TR) |
| LT1510IN#PBF | 功能描述:IC BATT CHARGER CONST V/I 16-DIP RoHS:是 类别:集成电路 (IC) >> PMIC - 电池管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 功能:电池监控器 电池化学:碱性，锂离子，镍镉，镍金属氢化物 电源电压:1 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-6 包装:带卷 (TR) |
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