参数资料
型号: LT1511CSW#TR
厂商: Linear Technology
文件页数: 13/16页
文件大小: 0K
描述: IC CHARGER BATT CONST V/I 24SOIC
标准包装: 1,000
功能: 充电管理
电池化学: 锂离子,镍镉,镍氢
电源电压: 6 V ~ 28 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC
包装: 带卷 (TR)
LT1511
APPLICATIO N S I N FOR M ATIO N
P BIAS = ( 3.5mA )( V IN ) + 1.5mA ( V BAT )
+ ( V BAT ) 2 [ 7.5mA + ( 0.012 )( I BAT ) ]
V IN
L1
C2
SW
LT1511
BOOST
( I BAT )( V BAT ) ? ? 1 + V BAT ? ? ?
P DRIVER =
2 ?
55 ( V IN )
30
V X
I VX
+
D2
10 μ F
SPIN
1511 ? F07
( I BAT ) ( 2 R SW BAT ) +
P SW
=
V IN
)( V
( t OL )( V IN )( I BAT )( f )
Figure 7. Lower V BOOST
( )( )( ) ? ? ? 1 + 3 30 3 . V ? ? ?
R SW = Switch ON resistance ≈ 0.16?
t OL = Effective switch overlap time ≈ 10ns
f = 200kHz
P DRIVER =
3 A 8 . 4 V 3 . 3 V
55 ( 15 V )
= 0 . 11 W
[ 7.5mA + ( )( ) 3 ] = 0.27W
( 8.4 ) 2
= = 34 mA
( )( ) 2 ? ? ? 1 + 8 30. 4 ? ? ?
55 ( 15 )
( 3 ) 2 ( 0.16 )( 8.4 ) + 10 ( 15 )( 3 )( 200kHz )
P SW =
( I BAT )( V BAT )( V X ) ? ? ? 1 + V 30 X ? ? ?
55 ( V IN )
Example: V IN = 15V, V BAT = 8.4V, I BAT = 3A;
P BIAS = ( 3.5mA )( 15 ) + 1.5mA ( 8.4 )
+ 0.012
15
3 8.4
P DRIVER = = 0.33W
? 9
15
= 0.81 + 0.09 = 0.9W
Total Power in the IC is: 0.27 + 0.33 + 0.9 = 1.5W
Temperature rise will be (1.5W)(30 ° C/W) = 45 ° C. This
assumes that the LT1511 is properly heat sunk by con-
necting the seven fused ground pins to expanded traces
and that the PC board has a backside or internal plane for
heat spreading.
The P DRIVER term can be reduced by connecting the boost
diode D2 (see Figure 1) to a lower system voltage (lower
than V BAT ) instead of V BAT .
Then P DRIVER =
For example, V X = 3.3V then:
The average I VX required is:
P DRIVER 0 . 11 W
V X 3 . 3 V
Fused-lead packages conduct most of their heat out the
leads. This makes it very important to provide as much PC
board copper around the leads as is practical. Total
thermal resistance of the package-board combination is
dominated by the characteristics of the board in the
immediate area of the package. This means both lateral
thermal resistance across the board and vertical thermal
resistance through the board to other copper layers. Each
layer acts as a thermal heat spreader that increases the
heat sinking effectiveness of extended areas of the board.
Total board area becomes an important factor when the
area of the board drops below about 20 square inches. The
graph in Figure 8 shows thermal resistance vs board area
for 2-layer and 4-layer boards with continuous copper
planes. Note that 4-layer boards have significantly lower
thermal resistance, but both types show a rapid increase
for reduced board areas. Figure 9 shows actual measured
lead temperatures for chargers operating at full current.
Battery voltage and input voltage will affect device power
dissipation, so the data sheet power calculations must be
used to extrapolate these readings to other situations.
Vias should be used to connect board layers together.
Planes under the charger area can be cut away from the
rest of the board and connected with vias to form both a
13
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