参数资料
型号: LT1711CMS8#TRPBF
厂商: Linear Technology
文件页数: 11/12页
文件大小: 0K
描述: IC COMP R-RINOUT SINGLE 8-MSOP
标准包装: 2,500
系列: UltraFast™
类型: 带锁销
元件数: 1
输出类型: CMOS,补充型,满摆幅,TTL
电压 - 电源,单路/双路(±): 2.4 V ~ 12 V,±2.4 V ~ 6 V
电压 - 输入偏移(最小值): 5mV @ 5V
电流 - 输入偏压(最小值): 5µA @ 5V
电流 - 输出(标准): 20mA
电流 - 静态(最大值): 22mA
CMRR, PSRR(标准): 75dB CMRR,85dB PSRR
传输延迟(最大): 6ns
磁滞: 100mV
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
安装类型: 表面贴装
包装: 带卷 (TR)
8
LT1711/LT1712
latch when a flow-through condition is desired. The latch
pin is designed to be driven with either a TTL or CMOS
output. It has built-in hysteresis of approximately 100mV,
so that slow moving or noisy input signals do not impact
latch performance.
For the LT1712, if only one of the comparators is being
used at a given time, it is best to latch the second compara-
tor to avoid any possibility of interactions between the two
comparators in the same package.
High Speed Design Techniques
The extremely fast speed of the LT1711/LT1712 necessi-
tates careful attention to proper PC board layout and
circuit design in order to prevent oscillations, as with
most high speed comparators. The most common prob-
lem involves power supply bypassing which is necessary
to maintain low supply impedance. Resistance and induc-
tance in supply wires and PC traces can quickly build up
to unacceptable levels, thereby allowing the supply volt-
ages to move as the supply current changes. This move-
ment of the supply voltages will often result in improper
operation. In addition, adjacent devices connected through
an unbypassed supply can interact with each other through
the finite supply impedances.
Bypass capacitors furnish a simple solution to this prob-
lem by providing a local reservoir of energy at the device,
thus keeping supply impedance low. Bypass capacitors
should be as close as possible to the LT1711/LT1712
supply pins. A good high frequency capacitor, such as a
1000pF ceramic, is recommended in parallel with larger
capacitors, such as a 0.1
F ceramic and a 4.7F tantalum
in parallel. These bypass capacitors should be soldered to
the output ground plane such that the return currents do
not pass through the ground plane under the input cir-
cuitry. The common tie point for these two ground planes
should be at the board ground connection. Such star-
grounding and ground plane separation is extremely im-
portant for the proper operation of ultra high speed circuits.
Poor trace routes and high source impedances are also
common sources of problems. Keep trace lengths as short
as possible and avoid running any output trace adjacent
to an input trace to prevent unnecessary coupling. If
output traces are longer than a few inches, provide proper
termination impedances (typically 100
to 400) to
eliminate any reflections that may occur. Also keep source
impedances as low as possible, preferably much less than
1k
.
The input and output traces should also be isolated from
one another. Power supply traces can be used to achieve
this isolation as shown in Figure 1, a typical topside layout
of the LT1712 on a multilayer PC board. Shown is the
topside metal etch including traces, pin escape vias and
the land pads for a GN16 LT1712 and its adjacent X7R
0805 bypass capacitors. The V+, Vand GND traces all
shield the inputs from the outputs. Although the two V
pins are connected internally, they should be shorted
together externally as well in order for both to function as
shields. The same is true for the two V+ pins. The two GND
pins are not connected internally, but in most applications
they are both connected directly to the ground plane.
APPLICATIO S I FOR ATIO
WU
UU
171112 F01
Figure 1. Typical LT1712 Topside Metal
for Multilayer PCB Layout
Hysteresis
Another important technique to avoid oscillations is to
provide positive feedback, also known as hysteresis,
from the output to the input. Increased levels of hyster-
esis, however, reduce the sensitivity of the device to input
voltage levels, so the amount of positive feedback should
be tailored to particular system requirements. The
LT1711/LT1712 are completely flexible regarding the
application of hysteresis, due to rail-to-rail inputs and the
complementary outputs. Specifically, feedback resistors
can be connected from one of the outputs to its corre-
sponding input without regard to common mode consid-
erations. Figure 2 shows several configurations.
相关PDF资料
PDF描述
LT1711CMS8#TR IC COMP R-RINOUT SINGLE 8-MSOP
LT1017IN8#PBF IC COMPARATOR MICROPWR DUAL 8DIP
LT1017IN8 IC COMPARATOR MICROPWR DUAL 8DIP
LTC1445CS#TRPBF IC COMP W/REF LOWPWR QUAD 16SOIC
AD7476ARTZ-500RL7 IC ADC 12BIT 1MSPS SOT-23-6
相关代理商/技术参数
参数描述
LT1711IMS8 功能描述:IC COMP R-RINOUT SINGLE 8-MSOP RoHS:否 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:通用 元件数:1 输出类型:CMOS,推挽式,满摆幅,TTL 电压 - 电源,单路/双路(±):2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V 电压 - 输入偏移(最小值):5mV @ 5.5V 电流 - 输入偏压(最小值):1pA @ 5.5V 电流 - 输出(标准):- 电流 - 静态(最大值):24µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):450ns 磁滞:±3mV 工作温度:-40°C ~ 85°C 封装/外壳:6-WFBGA,CSPBGA 安装类型:表面贴装 包装:管件 其它名称:Q3554586
LT1711IMS8#PBF 功能描述:IC COMP R-RINOUT SINGLE 8-MSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 标准包装:1 系列:- 类型:通用 元件数:1 输出类型:CMOS,开路集电极,TTL 电压 - 电源,单路/双路(±):2.7 V ~ 5.5 V 电压 - 输入偏移(最小值):7mV @ 5V 电流 - 输入偏压(最小值):0.25µA @ 5V 电流 - 输出(标准):84mA @ 5V 电流 - 静态(最大值):120µA CMRR, PSRR(标准):- 传输延迟(最大):600ns 磁滞:- 工作温度:-40°C ~ 85°C 封装/外壳:SC-74A,SOT-753 安装类型:表面贴装 包装:剪切带 (CT) 产品目录页面:1268 (CN2011-ZH PDF) 其它名称:*LMV331M5*LMV331M5/NOPBLMV331M5CT
LT1711IMS8#PBF 制造商:Linear Technology 功能描述:ICVOLT COMPARATORSINGLETSSOP8PINPLA 制造商:Linear Technology 功能描述:IC,VOLT COMPARATOR,SINGLE,TSSOP,8PIN,PLA
LT1711IMS8#TR 功能描述:IC COMP R-RINOUT SINGLE 8-MSOP RoHS:否 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:通用 元件数:1 输出类型:CMOS,推挽式,满摆幅,TTL 电压 - 电源,单路/双路(±):2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V 电压 - 输入偏移(最小值):5mV @ 5.5V 电流 - 输入偏压(最小值):1pA @ 5.5V 电流 - 输出(标准):- 电流 - 静态(最大值):24µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):450ns 磁滞:±3mV 工作温度:-40°C ~ 85°C 封装/外壳:6-WFBGA,CSPBGA 安装类型:表面贴装 包装:管件 其它名称:Q3554586
LT1711IMS8#TRPBF 功能描述:IC COMP R-RINOUT SINGLE 8-MSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:通用 元件数:1 输出类型:CMOS,推挽式,满摆幅,TTL 电压 - 电源,单路/双路(±):2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V 电压 - 输入偏移(最小值):5mV @ 5.5V 电流 - 输入偏压(最小值):1pA @ 5.5V 电流 - 输出(标准):- 电流 - 静态(最大值):24µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):450ns 磁滞:±3mV 工作温度:-40°C ~ 85°C 封装/外壳:6-WFBGA,CSPBGA 安装类型:表面贴装 包装:管件 其它名称:Q3554586