参数资料
型号: LT1713CMS8
厂商: Linear Technology
文件页数: 16/16页
文件大小: 0K
描述: IC COMP R-R I/O SINGLE LP 8MSOP
标准包装: 50
系列: UltraFast™
类型: 带锁销
元件数: 1
输出类型: CMOS,补充型,满摆幅,TTL
电压 - 电源,单路/双路(±): 2.4 V ~ 12 V,±2.4 V ~ 6 V
电压 - 输入偏移(最小值): 4mV @ 5V
电流 - 输入偏压(最小值): 2µA @ 5V
电流 - 输出(标准): 20mA
电流 - 静态(最大值): 7.5mA
CMRR, PSRR(标准): 70dB CMRR,80dB PSRR
传输延迟(最大): 11ns
磁滞: 100mV
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
安装类型: 表面贴装
包装: 管件
9
LT1713/LT1714
APPLICATIO S I FOR ATIO
WU
UU
Poor trace routes and high source impedances are also
common sources of problems. Keep trace lengths as
short as possible and avoid running any output trace
adjacent to an input trace to prevent unnecessary cou-
pling. If output traces are longer than a few inches,
provide proper termination impedances (typically 100
to 400
) to eliminate any reflections that may occur. Also
keep source impedances as low as possible, preferably
much less than 1k
.
The input and output traces should also be isolated from
one another. Power supply traces can be used to achieve
this isolation as shown in Figure 1, a typical topside layout
of the LT1713/LT1714 on a multilayer PC board. Shown is
the topside metal etch including traces, pin escape vias and
the land pads for a GN16 LT1713/LT1714 and its adjacent
X7R 0805 bypass capacitors. The V+, Vand GND traces
all shield the inputs from the outputs. Although the two V
pins are connected internally, they should be shorted to-
gether externally as well in order for both to function as
shields. The same is true for the two V+ pins. The two GND
pins are not connected internally, but in most applications
they are both connected directly to the ground plane.
1714 F01
Figure 1. Typical LT1714 Topside Metal for Multilayer PCB Layout
相关PDF资料
PDF描述
VI-JWZ-MY-F3 CONVERTER MOD DC/DC 2V 20W
LT1671CMS8 IC COMPARATOR 60NS LOW PWR 8MSOP
JBXEP2G19FCSDS CONN RCPT 19POS PANEL MNT CRIMP
LT6700HVIS6-3#TRPBF IC COMP DUAL 400MV REF TSOT23-6
JBXEA2G19FCSDS CONN RCPT 19POS DOUBLE NUT CRIMP
相关代理商/技术参数
参数描述
LT1713CMS8#PBF 功能描述:IC COMP R-R I/O SINGLE LP 8MSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 标准包装:1 系列:- 类型:通用 元件数:1 输出类型:CMOS,开路集电极,TTL 电压 - 电源,单路/双路(±):2.7 V ~ 5.5 V 电压 - 输入偏移(最小值):7mV @ 5V 电流 - 输入偏压(最小值):0.25µA @ 5V 电流 - 输出(标准):84mA @ 5V 电流 - 静态(最大值):120µA CMRR, PSRR(标准):- 传输延迟(最大):600ns 磁滞:- 工作温度:-40°C ~ 85°C 封装/外壳:SC-74A,SOT-753 安装类型:表面贴装 包装:剪切带 (CT) 产品目录页面:1268 (CN2011-ZH PDF) 其它名称:*LMV331M5*LMV331M5/NOPBLMV331M5CT
LT1713CMS8#TR 功能描述:IC COMP R-R I/O SINGLE LP 8MSOP RoHS:否 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 标准包装:25 系列:- 类型:带电压基准 元件数:4 输出类型:CMOS,开路漏极,TTL 电压 - 电源,单路/双路(±):2 V ~ 11 V,±1 V ~ 5.5 V 电压 - 输入偏移(最小值):10mV @ 5V 电流 - 输入偏压(最小值):- 电流 - 输出(标准):0.015mA @ 5V 电流 - 静态(最大值):8.5µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):12µs 磁滞:50mV 工作温度:0°C ~ 70°C 封装/外壳:16-DIP(0.300",7.62mm) 安装类型:通孔 包装:管件
LT1713CMS8#TRPBF 功能描述:IC COMP R-R I/O SINGLE LP 8MSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 标准包装:25 系列:- 类型:带电压基准 元件数:4 输出类型:CMOS,开路漏极,TTL 电压 - 电源,单路/双路(±):2 V ~ 11 V,±1 V ~ 5.5 V 电压 - 输入偏移(最小值):10mV @ 5V 电流 - 输入偏压(最小值):- 电流 - 输出(标准):0.015mA @ 5V 电流 - 静态(最大值):8.5µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):12µs 磁滞:50mV 工作温度:0°C ~ 70°C 封装/外壳:16-DIP(0.300",7.62mm) 安装类型:通孔 包装:管件
LT1713CMS8PBF 制造商:Linear Technology 功能描述:Comparator Single RRIO +/-6V/12V MSOP8
LT1713IMS8 功能描述:IC COMP R-R IN/OUT SINGLE 8-MSOP RoHS:否 类别:集成电路 (IC) >> 线性 - 比较器 系列:UltraFast™ 标准包装:25 系列:- 类型:带电压基准 元件数:4 输出类型:CMOS,开路漏极,TTL 电压 - 电源,单路/双路(±):2 V ~ 11 V,±1 V ~ 5.5 V 电压 - 输入偏移(最小值):10mV @ 5V 电流 - 输入偏压(最小值):- 电流 - 输出(标准):0.015mA @ 5V 电流 - 静态(最大值):8.5µA CMRR, PSRR(标准):80dB CMRR,80dB PSRR 传输延迟(最大):12µs 磁滞:50mV 工作温度:0°C ~ 70°C 封装/外壳:16-DIP(0.300",7.62mm) 安装类型:通孔 包装:管件