参数资料
型号: LT1763IDE#PBF
厂商: Linear Technology
文件页数: 20/22页
文件大小: 0K
描述: IC REG LDO ADJ .5A 12DFN
标准包装: 91
稳压器拓扑结构: 正,可调式
输出电压: 1.22 V ~ 20 V
输入电压: 1.8 V ~ 20 V
电压 - 压降(标准): 0.3V @ 500mA
稳压器数量: 1
电流 - 输出: 500mA
电流 - 限制(最小): 520mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 12-WFDFN 裸露焊盘
供应商设备封装: 12-DFN(4x3)
包装: 管件
产品目录页面: 1329 (CN2011-ZH PDF)

LT1763 Series
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
4.00 0.10
R = 0.115
0.40
0.10
0.70 0.05
(2 SIDES)
R = 0.05
7
TYP
12
TYP
3.60 0.05
3.30 0.05
3.00 0.10
3.30 0.10
2.20 0.05
1.70
0.05
PIN 1
TOP MARK
(2 SIDES)
1.70
0.10
PIN 1 NOTCH
(NOTE 6)
R = 0.20 OR
PACKAGE
0.35
45
OUTLINE
CHAMFER
6
1
(UE12/DE12) DFN 0806 REV D
0.25
0.05
0.200 REF
0.75 0.05
0.25
0.05
2.50 REF
0.50 BSC
2.50 REF
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
(4.801 – 5.004)
.045 ±.005
NOTE 3
.050 BSC
8
7
6
5
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.014 – .019
.050
(0.355 – 0.483)
TYP
(1.270)
BSC
.030 ±.005
TYP
1
2
3
4
.010 – .020
(0.254 – 0.508)
45°
RECOMMENDED SOLDER PAD LAYOUT
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
INCHES
NOTE:
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.016 – .050
(0.406 – 1.270)
SO8 0303
1763fg
20
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