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| 型号： | LT1794CFE |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 运动控制电子 |
| 英文描述： | Dual 500mA, 200MHz xDSL Line Driver Amplifier |
| 中文描述： | DUAL OP-AMP, 7500 uV OFFSET-MAX, 200 MHz BAND WIDTH, PDSO20 |
| 封装： | 4.40 MM, EXPOSED PAD, PLASTIC, TSSOP-20 |
| 文件页数： | 12/20页 |
| 文件大小： | 275K |
| 代理商： | LT1794CFE |
12
LT1794
EXAMPLE A
θ
JA
= 40
°
C/W
13MIL VIAS USED: 30
EXAMPLE B
θ
JA
= 47
°
C/W
13MIL VIAS USED: 35
EXAMPLE C
θ
JA
= 51
°
C/W
13MIL VIAS USED: 32
EXAMPLE D
θ
JA
= 60
°
C/W
13MIL VIAS USED: 22
TOPOLOGY
TOP LAYER
2nd LAYER
3rd LAYER
BOTTOM LAYER
VIA PATTERN
1794 F08
SCALE:
1 INCH
APPLICATIOU
Figure 8 shows four examples of PCB metal being used for
heat spreading. These are provided as a reference for what
might be expected when using different combinations of
metal area on different layers of a PCB. These examples are
with a 4-layer board using 1oz copper on each. The most
effective layers for spreading heat are those closest to the
LT1794 junction. The LT1794IFE is used because the
small TSSOP package is most effective for very compact
line driver designs. This package also has an exposed
metal heat sinking pad on the bottom side which, when
soldered to the PCB top layer metal, directly conducts heat
away from the IC junction. Soldering the thermal pad to the
W
U
U
Figure 8. Examples of PCB Metal Used for Heat Dissipation. LT1794IFE Driver Mounted on Top Layer.
Heat Sink Pad Soldered to Top Layer Metal. External Components Mounted on Bottom Layer
board produces a thermal resistance from junction to
case,
θ
JC
, of approximately 3
°
C/W.
Example A utilizes the most total metal area and provides
the lowest thermal resistance. Example B however uses
less metal on the top and bottom layers and still achieves
reasonable thermal performance. For the most compact
board design, inner layer metal can be used for heat
dissipation. This is shown in examples C and D where
minimum metal is used on the top and none on the bottom
layers, only the 2nd and 3rd layers have a heat-conducting
plane. Example C, with the larger metal areas performs
better.
相关PDF资料 |
PDF描述 |
|---|---|
| LT1794CSW | Dual 500mA, 200MHz xDSL Line Driver Amplifier |
| LT1794IFE | Dual 500mA, 200MHz xDSL Line Driver Amplifier |
| LT1796 | Overvoltage Fault Protected CAN Transceiver |
| LT1796CN8 | Overvoltage Fault Protected CAN Transceiver |
| LT1796CS8 | Overvoltage Fault Protected CAN Transceiver |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1794CFE#PBF | 功能描述:IC AMP XDSL LINE DRIVER 20TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:27 系列:- 类型:收发器 驱动器/接收器数:3/3 规程:RS232，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| LT1794CFE#TR | 功能描述:IC OPAMP 200MHZ DUAL 20-TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:27 系列:- 类型:收发器 驱动器/接收器数:3/3 规程:RS232，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| LT1794CFE#TRPBF | 功能描述:IC AMP XDSL LINE DRIVER 20TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:27 系列:- 类型:收发器 驱动器/接收器数:3/3 规程:RS232，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| LT1794CSW | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:27 系列:- 类型:收发器 驱动器/接收器数:3/3 规程:RS232，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件 |
| LT1794CSW#PBF | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,140 系列:AU 类型:收发器 驱动器/接收器数:1/1 规程:CAN 电源电压:5.3 V ~ 27 V 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商设备封装:14-SO 包装:管件 其它名称:935267940512AU5790D14AU5790D14-ND |
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