参数资料
型号: LT1946EMS8#TRPBF
厂商: Linear Technology
文件页数: 11/12页
文件大小: 0K
描述: IC REG BOOST 1.5A 8MSOP
标准包装: 2,500
类型: 升压(升压)
输出数: 1
输入电压: 2.45 V ~ 16 V
PWM 型: 电流模式
频率 - 开关: 2.7MHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
供应商设备封装: 8-MSOP
LT1946
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
0.52
(NOTE 3)
8
7 6 5
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.42 ± 0.038 0.65
(.0165 ± .0015) (.0256)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1
2 3
4
0.86
(.034)
REF
0.18
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
BOTTOM VIEW OF
EXPOSED PAD OPTION
5.23
(.206)
MIN
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
4.90 ± 0.152
(.193 ± .006)
8
7 6 5
0.52
(.0205)
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
1
2.06 ± 0.102
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
0.42 ± 0.038 0.65
(.0165 ± .0015) (.0256)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1
2 3
4
0.86
(.034)
REF
8
0.18
(.007)
SEATING
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8E) 0603
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
BSC
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
1946fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
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