参数资料
型号: LT1965IDD-3.3#PBF
厂商: Linear Technology
文件页数: 17/22页
文件大小: 0K
描述: IC REG LDO 3.3V 1.1A 8-DFN
产品培训模块: More Information on LDOs
标准包装: 121
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 最高 20V
电压 - 压降(标准): 0.31V @ 1.1A
稳压器数量: 1
电流 - 输出: 1.1A
电流 - 限制(最小): 1.2A
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
供应商设备封装: 8-DFN-EP(3x3)
包装: 管件
LT1965 Series
TYPICAL APPLICATIONS
Paralleling of Regulators for Higher Output Current
V IN > 3.7V
+
C1
100μF
R1
0.01?
IN OUT
LT1965-3.3
SHDN SENSE
+
C2
22μF
3.3V
2.2A
GND
SHDN
R2
0.01?
IN
LT1965
SHDN
OUT
ADJ
R6
6.65k
1%
R3
2.2k
R4
2.2k 3
+
1/2
8
1
GND
R5
10k
R7
4.02k
1%
2
LT1366
4
C3
0.01μF
1965 TA03
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
0.70 ± 0.05
R = 0.125
TYP
5
8
0.40 ± 0.10
3.5 ± 0.05 1.65 ± 0.05
2.10 ± 0.05 (2 SIDES)
0.25 ± 0.05
0.50
BSC
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
1.65 ± 0.10
(2 SIDES)
4
0.25 ± 0.05
2.38 ± 0.10
(DD8) DFN 0509 REV C
1
0.50 BSC
2.38 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
17
For more information www.linear.com/LT1965
1965fb
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LT1965IMS8E#PBF 功能描述:IC REG LDO ADJ 1.1A 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正,固定式 输出电压:8V 输入电压:10.5 V ~ 23 V 电压 - 压降(标准):1.7V @ 40mA 稳压器数量:1 电流 - 输出:100mA(最小值) 电流 - 限制(最小):- 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:剪切带 (CT) 产品目录页面:1075 (CN2011-ZH PDF) 其它名称:296-24390-1