参数资料
| 型号： | LT1969CMS#TR |
| 厂商： | Linear Technology |
| 文件页数： | 3/20页 |
| 文件大小： | 0K |
| 描述： | IC OP-AMP ADJ CURRNT DUAL 10MSOP |
| 标准包装： | 2,500 |
| 放大器类型： | 通用 |
| 电路数： | 2 |
| 转换速率： | 200 V/µs |
| 增益带宽积： | 700MHz |
| 电流 - 输入偏压： | 1.5µA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 7mA |
| 电流 - 输出 / 通道： | 700mA |
| 电压 - 电源，单路/双路(±)： | 4 V ~ 13 V，±2 V ~ 6.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
| 其它名称： | LT1969CMSTR |
11
LT1969
were taken in still air on 3/32" FR-4 board with 2oz copper.
This data can be used as a rough guideline in estimating
thermal resistance. The thermal resistance for each appli-
cation will be affected by thermal interactions with other
components as well as board size and shape.
Table 1. Fused 10-Lead MSOP Package
COPPER AREA
TOPSIDE*
BACKSIDE
BOARD AREA
THERMAL RESISTANCE
(mm2)(mm2)(mm2)
(JUNCTION-TO-AMBIENT)
540
2500
110
°C/W
100
2500
120
°C/W
100
0
2500
130
°C/W
30
0
2500
135
°C/W
0
2500
140
°C/W
*Device is mounted on topside.
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
TJ = (PD)(θJA) + TA
TJ = Junction Temperature
TA = Ambient Temperature
PD = Device Dissipation
θJA = Thermal Resistance (Junction-to-Ambient)
As an example, calculate the junction temperature for the
circuit in Figure 1 assuming an 70
°Cambienttemperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation and then
subtracting the dissipation in the load.
The dissipation for the amplifiers is:
PD = (63.5mA)(12V) – (4V/√2)2/(50) = 0.6W
The total package power dissipation is 0.6W. When a 2500
sq. mm PC board with 540 sq. mm of 2oz copper on top
and bottom is used, the thermal resistance is 110
°C/W.
The junction temperature TJ is:
TJ = (0.6W)(110°C/W) + 70°C = 136°C
The maximum junction temperature for the LT1969 is
150
°C so the heat sinking capability of the board is
adequate for the application.
If the copper area on the PC board is reduced to 0 sq. mm
the thermal resistance increases to 140
°C/W and the
junction temperature becomes:
TJ = (0.6W)(140°C/W) + 70°C = 154°C
which is above the maximum junction temperature indi-
cating that the heat sinking capability of the board is
inadequate and should be increased.
APPLICATIO S I FOR ATIO
WU
UU
Figure 1. Thermal Calculation Example
–
+
6V
–6V
909
100
100
–
+
1969 F01
1K
50
–4V
4V
f = 1MHz
13k
6
49.9k
CTRL1
CTRL2
7
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