参数资料
型号: LT1994CDD#PBF
厂商: Linear Technology
文件页数: 11/20页
文件大小: 0K
描述: IC DIFF AMP/DRIVER LN 8-DFN
标准包装: 121
放大器类型: 差分
电路数: 1
输出类型: 满摆幅
转换速率: 65 V/µs
增益带宽积: 70MHz
电流 - 输入偏压: 18µA
电压 - 输入偏移: 3000µV
电流 - 电源: 14.8mA
电流 - 输出 / 通道: 85mA
电压 - 电源,单路/双路(±): 2.375 V ~ 12.6 V,±1.188 V ~ 6.3 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
供应商设备封装: 8-DFN-EP(3x3)
包装: 管件
产品目录页面: 1322 (CN2011-ZH PDF)
19
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LT1994
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
2.38 0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.675 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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