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参数资料
| 型号： | LT3008MPTS8#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 20MA TSOT23-8 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 0.6 V ~ 44.5 V |
| 输入电压： | 2 V ~ 45 V |
| 电压 - 压降（标准）： | 0.3V @ 20mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 20mA |
| 电流 - 限制（最小）： | 22mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-8 薄型，TSOT-23-8 |
| 供应商设备封装： | TSOT-23-8 |
| 包装： | 标准包装 |
| 其它名称： | LT3008MPTS8#TRMPBFDKR |
LT3008 Series
APPLICATIONS INFORMATION
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or
microphone works. For a ceramic capacitor, the stress
can be induced by vibrations in the system or thermal
transients. The resulting voltages produced can cause
appreciable amounts of noise, especially when a ceramic
capacitor is used for noise bypassing. A ceramic capacitor
produced Figure 5’s trace in response to light tapping from a
pencil. Similar vibration induced behavior can masquerade
as increased output voltage noise.
V OUT = 0.6V
C OUT = 22μF
I LOAD = 10μA
V OUT
500 μ V/DIV
GND pin current is found by examining the GND Pin
Current curves in the Typical Performance Characteristics
section. Power dissipation is equal to the sum of the two
components listed prior.
The LT3008 regulator has internal thermal limiting designed
to protect the device during overload conditions. For
continuous normal conditions, do not exceed the maximum
junction temperature rating of 125°C. Carefully consider
all sources of thermal resistance from junction to ambient
including other heat sources mounted in proximity to
the LT3008. For surface mount devices, heat sinking is
accomplished by using the heat spreading capabilities of
the PC board and its copper traces. Copper board stiffeners
and plated through-holes can also be used to spread the
heat generated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 two-layer boards with
one ounce copper.
100ms/DIV
3008 F05
PCB layers, copper weight, board layout and thermal vias
Figure 5. Noise Resulting from Tapping
on a Ceramic Capacitor
Thermal Considerations
The LT3008’s maximum rated junction temperature of
affect the resultant thermal resistance. Although Tables
2 and 3 provide thermal resistance numbers for 2-layer
boards with 1 ounce copper, modern multilayer PCBs
provide better performance than found in these tables.
Table 2: Measured Thermal Resistance for DC Package
125°C limits its power-handling capability. Two components
comprise the power dissipated by the device:
COPPER AREA
TOPSIDE* BACKSIDE
BOARD
AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
1. Output current multiplied by the input/output voltage
differential: I OUT ? (V IN – V OUT )
2. GND pin current multiplied by the input voltage:
I GND ? V IN
2500mm 2
1000mm 2
225mm 2
100mm 2
50mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
65°C/W
70°C/W
75°C/W
80°C/W
85°C/W
*Device is mounted on the topside.
3008fc
14
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| LT3009EDC#TRMPBF | 功能描述:IC REG LDO ADJ 20MA 6-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:75 系列:- 稳压器拓扑结构:正，可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3，DPak（2 引线+接片），SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT |
| LT3009EDC#TRPBF | 功能描述:IC REG LDO ADJ 20MA 6-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.7V 输入电压:最高 5.5V 电压 - 压降（标准）:0.21V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:剪切带 (CT) 产品目录页面:1100 (CN2011-ZH PDF) 其它名称:576-1852-1 |
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