参数资料
型号: LT3011EDD#TRPBF
厂商: Linear Technology
文件页数: 11/16页
文件大小: 0K
描述: IC REG LDO ADJ 50MA 10-DFN
产品培训模块: LT3011 - 50mA, 3V to 80V Low Dropout Micropower Linear Regulator with PWRGD
More Information on LDOs
标准包装: 2,500
稳压器拓扑结构: 正,可调式
输出电压: 1.24 V ~ 60 V
输入电压: 2.8 V ~ 80 V
电压 - 压降(标准): 0.3V @ 50mA
稳压器数量: 1
电流 - 输出: 50mA
电流 - 限制(最小): 60mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 带卷 (TR)
LT3011
APPLICATIONS INFORMATION
During normal operation, an internal glitch ?lter will ignore
short transients (<15μs). Longer transients below the 90%
threshold will reset the JK ?ip-?op. This ?ip-?op ensures
that the capacitor on the C T pin is quickly discharged all
the way to the V CT(LOW) threshold before restarting the
time delay. This provides a consistent time delay after the
ADJ pin is within 10% of the regulated voltage before the
PWRGD pin switches to high impedance.
Thermal Considerations
The power handling capability of the device will be limited by
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. MSOP Measured Thermal Resistance
the maximum rated junction temperature (125°C, LT3011E/
COPPER AREA
THERMAL RESISTANCE
LT3011I or 150°C, LT3011H). The power dissipated by the
TOPSIDE
BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: I OUT ? (V IN – V OUT ) and,
2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm
225 sq mm 2500 sq mm
100 sq mm 2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
52°C/W
54°C/W
58°C/W
64°C/W
2. GND pin current multiplied by the input voltage:
I GND ? V IN
The GND pin current is found by examining the GND pin
current curves in the Typical Performance Characteristics
section. Power dissipation will be equal to the sum of the
two components listed above.
Table 2. DFN Measured Thermal Resistance
COPPER AREA
THERMAL RESISTANCE
TOPSIDE BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq mm 2500 sq mm 2500 sq mm 52°C/W
1000 sq mm 2500 sq mm 2500 sq mm 54°C/W
The LT3011 series regulators have internal thermal limiting
designed to protect the device during overload conditions.
For continuous normal conditions, the maximum junction
225 sq mm
100 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
58°C/W
64°C/W
temperature rating of 125°C (LT3011E/ LT3011I) or 150°C
(LT3011H) must not be exceeded. It is important to give
careful consideration to all sources of thermal resistance
from junction to ambient. Additional heat sources mounted
nearby must also be considered.
I CT 3μA
The thermal resistance junction-to-case ( θ JC ), measured
at the Exposed Pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage dif-
ferentials and maximum load current is not practical due
to thermal limitations. Transient operation at high input/
output differentials is possible. The approximate thermal
C T
PWRGD
time-constant for a 2500sq mm 3/32" FR-4 board, with
maximum topside and backside area for one ounce cop-
ADJ
V REF ? 90%
+
J
K
Q
V CT(HIGH)
– V BE
( 1.1V)
per, is three seconds. This time-constant will increase as
more thermal mass is added (i.e., vias, larger board and
other components).
For an application with transient high power peaks, average
power dissipation can be used for junction temperature
V CT(LOW)
0.1V
3011 F04
calculations as long as the pulse period is signi?cantly less
than the thermal time constant of the device and board.
Figure 4. PWRGD Circuit Block Diagram
3011f
11
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