参数资料
| 型号： | LT3012HFE#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .2A 16-TSSOP |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.24 V ~ 60 V |
| 输入电压： | 4 V ~ 80 V |
| 电压 - 压降（标准）： | 0.36V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA |
| 电流 - 限制（最小）： | 200mA |
| 工作温度： | -40°C ~ 140°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 16-TSSOP-EP |
| 包装： | 带卷 (TR) |
LT3012
APPLICATIONS INFORMATION
Voltage and temperature coef?cients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress, simi-
lar to the way a piezoelectric accelerometer or microphone
works. For a ceramic capacitor the stress can be induced
by vibrations in the system or thermal transients.
Current Limit and Safe Operating Area Protection
Like many IC power regulators, the LT3012 has safe oper-
ating area protection. The safe operating area protection
decreases the current limit as the input voltage increases
and keeps the power transistor in a safe operating region.
The protection is designed to provide some output current
at all values of input voltage up to the device breakdown
(see curve of Current Limit vs Input Voltage in the Typical
Performance Characteristics).
normal conditions the maximum junction temperature
rating of 125°C (E-Grade) or 140°C (H-Grade)must not
be exceeded. It is important to give careful consideration
to all sources of thermal resistance from junction to ambi-
ent. Additional heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. DFN Measured Thermal Resistance
The LT3012 is limited for operating conditions by maximum
junction temperature. While operating at maximum input
voltage, the output current range must be limited; when
operating at maximum output current, the input voltage
range must be limited. Device speci?cations will not apply
for all possible combinations of input voltage and output
COPPER AREA
TOPSIDE
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
40°C/W
45°C/W
50°C/W
62°C/W
current. Operating the LT3012 beyond the maximum junc-
Table 2. TSSOP Measured Thermal Resistance
tion temperature rating may impair the life of the device.
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature of (125°C for
LT3012E, or 140°C for LT3012HFE). The power dissipated
COPPER AREA
TOPSIDE
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
40°C/W
45°C/W
50°C/W
62°C/W
by the device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: I OUT ? (V IN – V OUT ) and,
2. GND pin current multiplied by the input voltage:
I GND ? V IN .
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Character-
istics. Power dissipation will be equal to the sum of the
two components listed above.
The LT3012 has internal thermal limiting designed to pro-
tect the device during overload conditions. For continuous
The thermal resistance junction-to-case ( θ JC ), measured
at the exposed pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage dif-
ferentials and maximum load current is not practical
due to thermal limitations. Transient operation at high
input/output differentials is possible. The approximate
thermal time constant for a 2500sq mm 3/32" FR-4 board
with maximum topside and backside area for one ounce
copper is 3 seconds. This time constant will increase as
more thermal mass is added (i.e., vias, larger board, and
other components).
3012fd
10
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