参数资料
| 型号： | LT3013HFE#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 19/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .2A 16-TSSOP |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 95 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.24 V ~ 60 V |
| 输入电压： | 4 V ~ 80 V |
| 电压 - 压降（标准）： | 0.36V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA |
| 电流 - 限制（最小）： | 200mA |
| 工作温度： | -40°C ~ 140°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 16-TSSOP-EP |
| 包装： | 管件 |
LT3013
PACKAGE DESCRIPTION
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
4.00 ±0.10
R = 0.115
0.38 ± 0.10
0.65 ±0.05
(2 SIDES)
R = 0.20
7
TYP
12
TYP
3.50 ±0.05
1.70 ±0.05
3.00 ±0.10
1.70 ± 0.10
2.20 ±0.05 (2 SIDES)
PACKAGE OUTLINE
PIN 1
TOP MARK
(NOTE 6)
(2 SIDES)
(2 SIDES)
PIN 1
NOTCH
(UE12/DE12) DFN 0603
6
1
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
0.50
BSC
0.200 REF
0.75 ±0.05
0.00 – 0.05
0.25 ± 0.05
3.30 ±0.10
(2 SIDES)
0.50
BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
3.58
(.141)
(.193 – .201)
3.58
(.141)
16 1514 13 12 11 10
9
6.60 ±0.10
2.94
2.94
4.50 ±0.10
SEE NOTE 4
(.116)
0.45 ±0.05
6.40
(.116) (.252)
BSC
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8
1.10
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
(.0433)
MAX
0.65
0.09 – 0.20
0.50 – 0.75
(.0256)
0.05 – 0.15
(.0035 – .0079)
(.020 – .030)
BSC
0.195 – 0.30
(.0077 – .0118)
(.002 – .006)
FE16 (BB) TSSOP 0204
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
2. DIMENSIONS ARE IN
MILLIMETERS
(INCHES)
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
3. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3013fe
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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| LT3013MPFE | 制造商:Linear Technology 功能描述:LDO Regulator Pos 1.24V to 60V 0.25A 16-Pin TSSOP EP |
| LT3013MPFE#PBF | 功能描述:IC REG LDO ADJ .25A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
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