参数资料
| 型号： | LT3022EMSE#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 1A 16MSOP |
| 产品培训模块： | LT3022 - 1A, 0.9V to 10V, Very Low Dropout Linear Regulator |
| 标准包装： | 37 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 0.2 V ~ 9.5 V |
| 输入电压： | 0.9 V ~ 10 V |
| 电压 - 压降（标准）： | 0.145V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1A |
| 电流 - 限制（最小）： | 1.1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TFSOP（0.118"，3.00mm 宽）裸露焊盘 |
| 供应商设备封装： | 16-MSOP，裸露焊盘 |
| 包装： | 管件 |
LT3022/LT3022-1.2
LT3022-1.5/LT3022-1.8
APPLICATIONS INFORMATION
To eliminate this problem, the LT3022 incorporates a
no-load or light load recovery circuit. This circuit is a
voltage-controlled current sink that significantly improves
the light load transient response time by discharging the
output capacitor quickly and then turning off. The current
sink turns on when the output voltage exceeds 6.5% of
the nominal output voltage. The current sink level is then
proportional to the overdrive above the threshold up to a
maximum of about 24mA. Consult the curve in the Typical
Performance Characteristics for the No-Load Recovery
Threshold.
If external circuitry forces the output above the no-load
recovery circuit’s threshold, the current sink turns on in
an attempt to restore the output voltage to nominal. The
current sink remains on until the external circuitry releases
the output. However, if the external circuitry pulls the output
voltage above the input voltage or the input falls below the
output, the LT3022 turns the current sink off and shuts
down the bias current/reference generator circuitry.
Thermal Considerations
The underside of the LT3022 DHC and MSE packages has
exposed metal from the lead frame to the die attachment.
Heat transfers directly from the die junction to the
printed circuit board metal, allowing maximum junction
temperature control. The dual-in-line pin arrangement
allows metal to extend beyond the ends of the package
on the topside (component side) of a PCB. Connect this
metal to GND on the PCB. The multiple IN and OUT pins
of the LT3022 also assist in spreading heat to the PCB.
Copper board stiffeners and plated throughholes can also
be used to spread the heat generated by power devices.
The following tables list thermal resistance as a function
of copper area in a fixed board size. All measurements are
taken in still air on a 4-layer FR-4 board with 1oz solid
internal planes, and 2oz external trace planes with a total
board thickness of 1.6mm. For more information on thermal
resistance and high thermal conductivity test boards,
refer to JEDEC standard JESD51, notably JESD51-12 and
JESD51-7. Achieving low thermal resistance necessitates
attention to detail and careful PCB layout.
Table 2. Measured Thermal Resistance for DHC Package
The LT3022’s maximum rated junction temperature of
125°C limits its power handling capability. Two components
comprise the power dissipation of the device:
1. Output current multiplied by the input-to-output voltage
differential:
(I LOAD ) ? (V IN – V OUT ) and
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA
2500mm 2 2500mm 2 2500mm 2
1000mm 2 2500mm 2 2500mm 2
225mm 2 2500mm 2 2500mm 2
100mm 2 2500mm 2 2500mm 2
*Device is mounted on topside
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
35°C/W
37°C/W
38°C/W
40°C/W
2. GND pin current multiplied by the input voltage:
Table 3. Measured Thermal Resistance for MSE Package
(I GND ) ? (V IN )
GND pin current is found by examining the GND pin current
curves in the Typical Performance Characteristics. Power
dissipation equals the sum of the two components listed.
The LT3022’s internal thermal limiting (with hysteresis)
protects the device during overload conditions. For normal
continuous conditions, do not exceed the maximum
junction temperature rating of 125°C. Carefully consider
all sources of thermal resistance from junction to ambient
including other heat sources mounted in proximity to the
LT3022.
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA
2500mm 2 2500mm 2 2500mm 2
1000mm 2 2500mm 2 2500mm 2
225mm 2 2500mm 2 2500mm 2
100mm 2 2500mm 2 2500mm 2
*Device is mounted on topside.
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
35°C/W
37°C/W
38°C/W
40°C/W
3022fb
14
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3022EMSE-TR | 制造商:LINER 制造商全称:Linear Technology 功能描述:1A, 0.9V to 10V, Very Low Dropout Linear Regulator |
| LT3022EMSE-TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:1A, 0.9V to 10V, Very Low Dropout Linear Regulator |
| LT3022IDHC | 制造商:Linear Technology 功能描述:LDO Regulator Pos 0.2V to 9.5V 1A 16-Pin DFN EP |
| LT3022IDHC#PBF | 功能描述:IC REG LDO ADJ 1A 16DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:8V 输入电压:10.5 V ~ 23 V 电压 - 压降（标准）:1.7V @ 40mA 稳压器数量:1 电流 - 输出:100mA（最小值） 电流 - 限制（最小）:- 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:剪切带 (CT) 产品目录页面:1075 (CN2011-ZH PDF) 其它名称:296-24390-1 |
| LT3022IDHC#TRPBF | 功能描述:IC REG LDO ADJ 1A 16DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:2.3 V ~ 5.5 V 电压 - 压降（标准）:0.035V @ 150mA 稳压器数量:2 电流 - 输出:150mA 电流 - 限制（最小）:300mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:6-UFDFN 裸露焊盘，6-TMLF? 供应商设备封装:6-TMLF?（1.6x1.6） 包装:Digi-Reel® 产品目录页面:1104 (CN2011-ZH PDF) 其它名称:576-3018-6 |
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