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参数资料
| 型号： | LT3022IMSE-1.8#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.8V 1A 16-MSOP |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.8V |
| 输入电压： | 最高 10V |
| 电压 - 压降（标准）： | 0.145V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1A |
| 电流 - 限制（最小）： | 1.1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TFSOP（0.118"，3.00mm 宽）裸露焊盘 |
| 供应商设备封装： | 16-MSOP，裸露焊盘 |
| 包装： | 带卷 (TR) |
LT3022/LT3022-1.2
LT3022-1.5/LT3022-1.8
PACKAGE DESCRIPTION
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev E)
BOTTOM VIEW OF
EXPOSED PAD OPTION
5.23
(.206)
MIN
2 .845 ± 0.10 2
(.112 ± .004)
0.889 ± 0.127
(.035 ± .005)
1.651 ± 0.102 3.20 – 3.45
(.065 ± .004) (.126 – .136)
1
2 .845 ± 0.10 2
(.112 ± .004)
8
1.651 ± 0.102
(.065 ± .004)
0.12 REF
DETAIL “B”
0.35
REF
CORNER TAIL IS PART OF
0.305 ± 0.038 0.50
(.0120 ± .0015) (.0197)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
DETAIL “A”
0.254
16 9
4 .039 ± 0.10 2
(.159 ± .004)
(NOTE 3)
16151413121110 9
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.280 ± 0.076
(.011 ± .003)
REF
GAUGE PLANE
(.010)
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.53 ± 0.152
(.021 ± .006)
0.18
(.007)
DETAIL “A”
1.10
(.043)
MAX
1234567 8
0.86
(.034)
REF
0.17 – 0.27
0.50
TYP
(.0197)
BSC
SEATING
PLANE
(.007 – .011)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MSE16) 0911 REV E
3022fb
18
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