参数资料
型号: LT3050IMSE-5#TRPBF
厂商: Linear Technology
文件页数: 21/26页
文件大小: 0K
描述: IC REG LDO 5V .1A 12-MSOP
标准包装: 2,500
稳压器拓扑结构: 正,固定式
输出电压: 5V
输入电压: 最高 45 V
电压 - 压降(标准): 0.34V @ 100mA
稳压器数量: 1
电流 - 输出: 100mA
电流 - 限制(最小): 110mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 12-TSSOP (0.118",3.00mm 宽)裸露焊盘
供应商设备封装: 12-MSOP,裸露焊盘
包装: 带卷 (TR)
LT3050 Series
APPLICATIONS INFORMATION
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes also can spread the heat generated by
power devices. The following tables list thermal resis-
tance as a function of copper area in a ?xed board size.
All measurements were taken in still air on a four-layer
FR-4 board with one ounce solid internal planes and two
ounce external trace planes with a total board thickness
of 1.6mm. For further information on thermal resistance
and using thermal information, refer to JEDEC standard
JESD51, notably JESD51-12.
Table 1. MSOP Measured Thermal Resistance
The power dissipated by the device equals:
I OUT(MAX) * (V IN(MAX) – V OUT ) + I GND * V IN(MAX)
where,
I OUT(MAX) = 75mA
V IN(MAX) = 12.6V
I GND at (I OUT = 75mA, V IN = 12V) = 1.5mA
So,
P = 75mA ? (12.6V - 5V) + 1.5mA ? 12.6V = 0.589W
Using a DFN package, the thermal resistance ranges from
44°C/W to 49°C/W depending on the copper area. So the
COPPER AREA
TOPSIDE BACKSIDE
BOARD
AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
junction temperature rise above ambient approximately
equals:
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
225 sq mm 2500 sq mm 2500 sq mm
100 sq mm 2500 sq mm 2500 sq mm
Table 2. DFN Measured Thermal Resistance
40°C/W
41°C/W
43°C/W
45°C/W
0.589W ? 49°C/W = 28.86°C
The maximum junction temperature equals the maximum
ambient temperature plus the maximum junction tempera-
ture rise above ambient or:
T JMAX = 85°C + 28.86°C = 113.86°C
COPPER AREA
THERMAL RESISTANCE
TOPSIDE
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
(JUNCTION-TO-AMBIENT)
44°C/W
45°C/W
47°C/W
49°C/W
Protection Features
The LT3050 incorporates several protection features that
make it ideal for use in battery-powered circuits. In ad-
dition to the normal protection features associated with
monolithic regulators, such as current limiting and thermal
Calculating Junction Temperature
Example: Given an output voltage of 5V, an input voltage
range of 12V ±5%, a maximum output current range of
75mA and a maximum ambient temperature of 85°C, what
will the maximum junction temperature be?
limiting, the device also protects against reverse-input
voltages, reverse-output voltages and reverse output-to-
input voltages.
Current limit protection and thermal overload protection
protect the device against current overload conditions at
the output of the device. For normal operation, do not
exceed a junction temperature of 125°C.
3050fa
21
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